New Industry Realities and Opportunities at Semiconductor Manufacturing Conference

New Industry Realities and Opportunities at Semiconductor Manufacturing Conference

Manufacturers, suppliers and academia gather to discuss semiconductor manufacturing at SEMI event

SAN JOSE, Calif.  — February 22, 2016 — The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York. The conference will feature 35 hours of technical presentations and over 100 experts covering all aspects of advanced semiconductor manufacturing. This year’s event features a panel discussion on “Moore’s Law… Wall vs. Wallet… Where Do We Grow from Here?” and a tutorial on Nanoscale III-V CMOS by Dr. Jesús A. del Alamo, director, Microsystems Technology Laboratories, MIT.

SEMI’s ASMC continues to provide a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.  The conference is co-chaired by Dr. Jeanne Bickford of GLOBALFOUNDRIES and Dr. Janay Camp of KLA-Tencor.  ASMC 2016 offers keynotes by Christine Furstoss, VP and technical director, Manufacturing & Materials Technologies, GE Global Research on “Advanced Manufacturing…Changing Today’s Paradigm,” and Robert Maire, president, Semiconductor Advisors, on “Is China Driving the Urge to Merge?”

The topical areas that ASMC 2016 will address include:

  • 3D/TSV

  • Advanced Equipment and Materials Processes

  • Advanced Metrology

  • Advanced Patterning

  • Advanced Process Control (APC)

  • Contamination Free Manufacturing (CFM)

  • Yield Management; Defect Inspection

  • Equipment Reliability and Productivity Enhancement

  • Factory Optimization

ASMC includes an interactive poster session and reception, which provides an ideal opportunity for networking between authors and conference attendees.

ASMC 2016 is presented by SEMI with technical sponsors: Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Components, Packaging and Manufacturing Technology Society (CPMT). Corporate sponsors include: Air Liquide, Applied Materials, Applied Seals, Edwards, FEI, Greene Tweed, JT Baker – Avantor, KLA-Tencor, Metryx, Nikon, Teflon Fluoroplastics, and Valqua America. 

Registration for ASMC 2016 is available at  For more information contact Margaret Kindling at or phone 1.202.393.5552. Qualified members of the media should contact Deborah Geiger (SEMI Public Relations) at for media registration information.

About SEMI

SEMI® connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit; please follow SEMI on LinkedIn and Twitter.

Association Contact

Deborah Geiger/SEMI
Phone: 408.943.7988

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