Session 14: Standards & Reliability
IPC - Printed Electronics Design Standards Update
Thursday, February 15, 2018
8:00 AM - 8:25 AM
IPC has published a design standard IPCC-2292 for printed electronic assemblies. This talk goes into greater depth regarding the standardized descriptions to help designers and engineers in their design process. This is applicable to flexible and 3D printed electronics. Challenges facing ETextiles will also be covered.
Neil has been involved in the printing industries for 38 years. He has a bachelor’s degree in chemistry from London University (Queen Mary College) and a master of business administration degree from Roosevelt University, Chicago. Neil has experience in production, quality control and technical service functions. For the past 31 years, he has worked in the United States, primarily in the technical field of customer support, quality requirements and regulatory compliance, helping customers with their product and manufacturing challenges, handling how-to questions and product development. In his latest position, Neil handles the company’s technical service in North America for their High Performance Film Systems. Neil actively supports the technical printing needs of their customers, and the development of the products required for printed and flexible electronics applications. Neil is also an active participant on numerous IPC committees, and is the co-chairman of the Printed Electronics General Committee (D60), vice chairman of D62 substrates and co-chairman of D65 Test Methods for printed electronics. Neil was elected into the SGIA's Academy of Screen & Digital Printing Technologies in 2007
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