MEMS & Sensors Technical Congress 2017

Hosted By
Wednesday, May 10, 2017 to Thursday, May 11, 2017
Stanford University, Bechtel Conference Center, Stanford, California, United States
 
Register  Wednesday, May 10, 2017 - 16:45
 

Working Together to Solve Technical Challenges and Increase Value across the MEMS and Sensors Supply Chain

MEMS & Sensors Industry Group has been hosting its annual technical conference since 2001, we look forward to hosting our 2017 event with our Strategic Association Partner, SEMI. Building directly upon the theme and issues emanating from the 2016 MEMS & Sensors Executive Congress, the 2017 MEMS & Sensors Technical Congress (MSTC) will take a closer look at how companies in the MEMS and sensors supply chain can thrive in a challenging environment. Among the key challenges facing the industry today are:

  • Creating higher integration devices with lower power
  • Cybersecurity/security at the sensor node
  • Energy and power management
  • Ever-expanding Internet of Things (IoT) applications requiring optimized solutions
  • Smaller and flexible form factors (including testing and packaging)
  • Cloud/fog/edge computing
  • A tsunami of data on the near horizon that will require machine learning
  • Migrating from component provider to systems solution provider

The 2017 MSTC will focus on these and other challenges with thought-provoking technical content and breakout sessions that will delve deeper into the issues and possible solutions. 

Attendee Profile:

MSIG Attendee by CountryMSIG ChartMSIG Chart

Speaker Selection Committee

  • Allyson Hartzell, Veryst
  • David Horsley, University of California, Davis
  • Mike Mignardi, Texas Instruments
  • Rob O’Reilly, Analog Devices
  • Dirk Ortloff, camLine
  • Eric Pabo, EV Group
  • Jason Weigold, MEMStaff
  • Roger T. Howe, Stanford University
  • Thomas Kenny, Stanford University

Contact

Karen Lightman, Executive Director
MEMS and Sensors Industry Group
klightman@memsindustrygroup.org

For the 2017 MEMS and Sensors Technical Congress Agenda, please click:  MSTC 2017 Agenda

Agenda: Capturing Value from MEMS and Sensors from a Technical Perspective

WEDNESDAY, MAY 10, 2017

8:30 - 9:00 amWelcome Coffee and Registration
9:00 - 9:30 

Morning kickoff

  • Welcome by Stanford- System X Alliance
  • Welcome by Karen Lightman VP, MEMS & Sensors Industry Group, SEMI
9:30 - 10:15 Keynote: Prof Chris Ré
Assistant Professor, Department of Computer Science, Stanford University
10:15 - 10:45Coffee Break
10:45 - 11:15 Sensor Integration: What does it mean and what are its benefits?  (Abstract)
Jay Esfandyari Director, Global Product Marketing Strategy, STMicroelectronics
11:15 - 11:45 Enabling Easy Customization of MEMS Sensors for Integrated High-Value Solutions  (Abstract)
Stephen Breit,  Vice President of Engineering, Coventor
11:45 - 12:15 pmHigh-performance MEMS Accelerometers for Gravity Mapping  (Abstract)
Paul Vickery, Executive Chairman and Director, Silicon Microgravity
12:15 - 1:30 Lunch
1:30 – 2:00 

A Lens-less SMD Thermopile Solution for Near Field People Recognition in Today’s Thin Battery Operated Devices  (Abstract) 
Prometeusz Jasinski, Applications Engineer, Excelitas Technologies

2:00 - 3:00 Panel Discussion (Abstract): Academic and Commercial Perspective on Capturing Value from MEMS and Sensors
Moderator Allyson Hartzell Managing Engineer, Veryst Engineering;
Panelists:  Sanjay Bhandari, Ph.D., CTO & Sr. Vice President, mCube Inc
                    Uma Krishnamoorthy, Bosch (Invited)
                    Prof. Debbie Senesky and Prof. Jon Fan, Stanford University
3:00 - 3:30 Coffee Break and walk to Nanofab
3:30 - 5:00 

Tour of Nanofab by Stanford- System X Alliance/ Students

5:00 - 7:00Reception with poster session for Stanford faculty and students

THURSDAY, MAY 11, 2017

8:15 - 8:45 amWelcome Coffee
9:00 – 9:45 Morning Kickoff: Karen Lightman VP, MEMS & Sensors Industry Group, SEMI
9:45 - 10:15 Keynote: Scott Borg
                  Director and Chief Economist, U.S. Cyber Consequences Unit
10:15 - 10:45 Smart MEMS Sensors for Robot Applications  (Abstract)
Shuji Tanaka, Professor, Tohoku University
10:45 -11:15 Coffee Break
11:15 -11:45 Development of a High-Performance MicroHigh-Performancing the MEMS Ecosystem  (Abstract)
Carolyn White, Associate, AMFitzgerald
11:45 - 12:15 pmMEMS Spectral Sensors Enabling New Applications for Material Analysis  (Abstract)
Scott Smyser, Executive Vice President, W/W Marketing &Business Development, Si-Ware Systems
12:15 - 12:45Flexible Layout, More Dies Per Wafer by Plasma Dicing Technology  (Abstract) 
Yannick Pilloux, Business Development Manager, Plasma-Therm
12:45 - 2:45 Lunch/Breakout Discussions (at tables)
2:45 – 3:00 Coffee Break
3:00 - 3:45 Breakout sessions report, group discussion, wrap up/call to action
Closing Remarks

Pricing:

2/1/2017 - 3/28/2017

Early Bird Member - $600

Early Bird Non Member - $990

Early Bird Speakers/Session Leaders - Member $200.00

Early Bird Speakers/Session Leaders - Non Member $300.00

3/29/2017 - 4/26/2017

Regular Member - $700

Regular Non Member - $1090

Regular Speakers/Session Leaders - Member $200.00

Regular Speakers/Session Leaders - Non Member $300.00

4/27/2017- 5/9/2017

Late Member - $800

Late Non Member - $1190

Late Speakers/Session Leaders - Member $300.00

Late Speakers/Session Leaders - Non Member $400.00

Other:

2/1/2017 - 5/09/2017

Spouse/Significant Other Member/Non Member - $200

 

Conference Venue

Bechtel Conference Center
Stanford University
616 Serra Street, Stanford, CA 94305
Stanford University Map and Directions

Major Airports

Lodging

  • Stanford’s location adjacent to Palo Alto and Menlo Park offers an abundance of lodging choices.
  • For a list of lodging options, please click here

Get Noticed as a Leader in the MEMS and Sensors Industry!

MEMS & Sensors Industry Group® consistently offers opportunities to broaden your competitive advantage, by increasing your credibility, image, and prestige by sponsoring MSIG and other MEMS industry events.

Sponsorships are available to MSIG members only. Not a member? Learn about our membership benefits

Sponsorship Opportunities

For sponsorship opportunities, click: MEMS & Sensors Technical Congress 2017

To find our how you can sponsor, please contact:

Eric Rude
Sr. Manager, Sales, Exhibitions & Events
SEMI, FlexTech, MEMS & Sensors Industry Group
Tel: 1.408. 943.7047 l mobile: 1.312.613.5567 
Em: erude@semi.org  

Karen Lightman
V.P. MEMS & Sensors Industry Group
Tel: (412) 390.1644
Em: klightman@semi.org

Event Contact:

Lin Tso
Sr. Programs Manager
Tel: (408) 943.7920
Em: ltso@semi.org

Working Together to Solve Technical Challenges and Increase Value across the MEMS and Sensors Supply Chain

MEMS & Sensors Industry Group has been hosting its annual technical conference since 2001, we look forward to hosting our 2017 event with our Strategic Association Partner, SEMI. Building directly upon the theme and issues emanating from the 2016 MEMS & Sensors Executive Congress, the 2017 MEMS & Sensors Technical Congress (MSTC) will take a closer look at how companies in the MEMS and sensors supply chain can thrive in a challenging environment. Among the key challenges facing the industry today are:

  • Creating higher integration devices with lower power
  • Cybersecurity/security at the sensor node
  • Energy and power management
  • Ever-expanding Internet of Things (IoT) applications requiring optimized solutions
  • Smaller and flexible form factors (including testing and packaging)
  • Cloud/fog/edge computing
  • A tsunami of data on the near horizon that will require machine learning
  • Migrating from component provider to systems solution provider

The 2017 MSTC will focus on these and other challenges with thought-provoking technical content and breakout sessions that will delve deeper into the issues and possible solutions. We are looking for compelling abstracts from speakers who will address the aforementioned topics and have recommendations for moving the industry forward to meet these challenges to commercialization from a technical perspective.

The deadline for submission was January 11, 2017.

Any questions, please contact
Karen Lightman, Executive Director
MEMS and Sensors Industry Group
klightman@memsindustrygroup.org

MEMS & Sensors Technical Congress 2017