Mr. Hackler is President & CEO of American Semiconductor and the co-inventor of Semiconductor-on-Polymer technology. He is a hybrid electronics industry leader known for his commitment to industry development of ultra-thin electronics. He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents for conventional and flexible solid state technology and has published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).