Session 15: Inline Inspection
Metrology Tools for Flexible Electronics and Display Substrate
Wednesday, June 21, 2017
5:20 PM - 5:40 PM
This paper will discuss about metrology tools that could be used to characterize the critical dimensions of various features, surface morphologies and defects on flexible electronic circuits and display substrates. Different tools will be compared for various applications. Automatic classification and/or binning techniques will be explored.
Dr. Min joined Bruker Nano Surfaces as Director of Applications Development, responsible for developing new applications for tribology, optical and stylus metrology, and optical coordinate measurement. Min has over 20 years of experience in tribology, metrology and failure analysis, mostly in the data storage business in Silicon Valley. She started her career as a tribology integration engineer for head/disk interface designs and held a number of positions at IBM and Western Digital in tribology and failure analysis. Prior joining Bruker, Min was an Engineering Director at Western Digital, responsible for the development of tribology and failure analysis testing on a wide variety of instruments including, SEM/EDX, AFM, FIB, TOF-SIMS, FTIR, Raman, optical analysis tools, and test chambers. Min holds a BSEE from Beijing University of Technology, a Masters in Materials Science from Beijing Aeronautical Materials Institute, and both a Masters in Mechanical Engineering and a PhD in System Engineering from UC San Diego.
Bruker Nano Surfaces