Session 12: Conductors II
Advancements in Printing nano Copper and Using Existing Copper Based Manufacturing Processes
Wednesday, June 21, 2017
1:30 PM - 1:55 PM
Until now, much of the driving force for using nano copper inks and pastes in flexible and hybrid electronics applications has been the cost benefits of copper compared to other noble metals. In the course of developing copper inks and pastes for real world applications, we have found that the ability of printed copper to be soldered to and used as the core conductive material that matches existing worldwide copper back-end processing providing further manufacturing benefits beyond the lower cost of copper. In this presentation, we will show that nano copper inks and pastes can be applied to low temperature and flexible plastic substrates by a variety of deposition methods including inkjet printing, screen printing, slot die coating, aerosol jetting, ultrasonic spraying, and pneumatic pumping. A variety of sintering techniques appropriate to particular substrates has been used to create final highly conductive copper conductors. We will show how existing, worldwide, manufacturing back-end processes such as masking, plating, etching, soldering and pick & place can be used to create printed interconnected components for real world production applications.
Mike Carmody received his BS in Chemistry from the University of Detroit and a PhD in Organic Chemistry from The Ohio State University. He worked 32 years in the Research and Development Laboratories at Eastman Kodak in Rochester, NY from which he retired as a Senior Research Fellow. He joined Intrinsiq Materials in 2011. His work has focused on the development of novel materials for imaging systems and properties, development, and manufacturing of inkjet inks. His management experiences include Laboratory Head of Kodak Dye Research, Ink Flow Manager, and Director of the OLED Devices R&D lab. He has served as adjunct faculty at the Rochester Institute of Technology, Monroe Community College, and SUNY Brockport.