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What is the Technology Showcase?
The Technology Showcase presents products from startups, established companies, researchers, and individuals seeking to demo their inventions to the over 250 senior-level executives from MEMS and sensors companies attending MEMS & Sensors Executive Congress 2017. We seek new and innovative products to address needs in the consumer marketplace. Each demo submission needs to clearly deﬁne which aspects of MEMS and/or sensors will be demonstrated and how.
Additionally, each presenter will display the signiﬁcance of the contribution that their product is making/will make on the current tech market or application. At the Congress, participants will have ﬁve minutes to present their demo live and ﬁve minutes for Q&A from the audience as part of the MEMS & Sensors Technology Showcase. At the conclusion of the Technology Showcase, audience members will vote to select the winner.
Congratulations to our Technology Showcase Finalists
The Berries Smart Sensor series
The patented and compact eLichens Autonomous Smart Gas Sensor is offered in a 2x2x1cm package, integrating a dual channel feature for a calibration-free long-life cycle. The miniaturized optical gas sensor is a complete system on package integrating proprietary infrared MEMS source & detectors, a highly efficient patented optical sampling chamber and the signal processing necessary to enable a high-accuracy, factory calibrated product.
eLichens miniaturized Smart Gas Sensor delivers the ultimate advancements in NDIR technology and is the foundation of a multi-gas sensing product portfolio. eLichens patented technology allows an aggressive cost reduction product roadmap to address the broader fast-growing gas and air quality sensing market.
“eLichens CH4 and CO2 smart gas sensors solutions set a new industry standard with high performance, tiny footprint and ultra-low power consumption” said Marc Attia, eLichens’ CMO. “Our pioneered NDIR technology and smart sensors offerings address the demanding requirements of the gas sensing industries, where accuracy, auto-calibration, and power consumption are essential for new generations of gas and air detection products”.
eLichens has sampled its CH4 & CO2 Smart Gas Sensors and is currently engaged with leading OEMs on various applications.
The LEIF eSnowboard
Industrial workers face many dangers as well as many regulations. Maven Machines' IoT platform innovative devices like the patented Maven Co-Pilot smart headset help augment industrial workers and automate their regulatory work-flows. At the heart of this system is MEMS technology that can detect movements, orient position, sense the environment, and communicate in real-time.
Employing sensor fusion, wearable technology, machine intelligence, and mobile-cloud architecture, Maven has pioneered Industrial IoT (IIoT) to benefit of worker safety, operational efficiency, and improved regulatory compliance.
The Maven Co-Pilot is the first smart headset to monitor and detect driver fatigue & distraction in real-time. Paired with a GPS enabled mobile device, the headset features active coaching for speeding, braking, as well as real-time navigation, traffic, and weather updates.
Maven's has been included in numerous Top 100 industrial IoT startups. Demo live MEMS-based IoT platform and see how Maven has leveraged a small earbud to provides real-time safety, end-to-end telematics, and automatic compliance for hours of service along with voice guided vehicle inspections.
Menlo Digital-Micro-Switch Technology
Driven by the extreme operating conditions required by General Electric's industrial businesses, the GE team was led to look at the micro-mechanical switch from an entirely different perspective. That different approach led to a deep understanding of failure modes, and in turn, the development of a unique set of patented metal alloys and processing techniques that enable reliable operation without sacrificing performance. Key markets for this disruptive technology include today's mobile communications networks to future next generation 5G networks and industrial IoT markets.
Some of the key attributes of the Menlo Micro switch technology include:
Extremely Small Size. Menlo Micro switching elements are smaller than the width of a human hair and are architected to be scalable, depending on the power ratings required. They are so small we can fit hundreds of them in a space smaller than 10mm2.
Solid-State Speeds. A typical mechanical switch might operate in a few milliseconds, whereas Menlo Micro switches can operate 1000x faster, in only a few microseconds. This can have enormous implications on systems that were previously limited in performance by how fast they could reconfigure, or open and close critical circuits.
Power Handling. This is an area where Menlo Micro completely throws conventional wisdom out the window. When faced with the prospect of handling higher power levels, most people think bigger. More mass, more metal, larger air gaps between conductors. We took a different approach. We make everything smaller and move the electrical contacts closer and closer together. Our miniaturized switches and scalable architecture allows us to handle 100s of volts and 10s of amps without arcing.Reliability. When you are developing products to meet the needs of businesses that serve markets like healthcare, aviation, and other mission-critical industrial applications, reliability is not an after-thought, it's the primary design criteria. Our mechanical switching device has lifetimes more than 1000x longer than traditional mechanical switches; not millions of cycles, but billions of cycles without degrading performance
Coupled Time Domain Simulation for MEMS Sensors and System Integration
As the MEMS sensor industry continue its strong growth trend, early, reliable simulation of MEMS sensor designs has become a critical path item for many MEMS vendors competing in highly aggressive markets with ever shortening design cycles. Finite Element Analysis (FEA) simulation has played a key role in accelerating the design of MEMS sensors by providing valuable insights into complex, coupled physics for new MEMS areas such as Piezoelectric Micromachined Ultrasonic Transducers (PMUTs) for fingerprint sensing.
However, the challenge for MEMS engineers is not limited to discrete device innovation and fabrication. Modern MEMS designers must optimize the performance of large arrays of devices and effectively mitigate downstream integration challenges when devices are placed into completed systems such as a modern smartphone.
This presentation discusses how large-scale time-domain FEA simulation using PZFlex can provide new insights into discrete device performance, device array performance, and full system performance for a PMUT Fingerprint Sensor embedded within a smartphone touch-display stackup.
In addition, this work also investigates potential performance issues that arise from external environmental stimuli such as thermal cycling of the entire stackup. Transient simulation techniques are employed to study mechanical stresses that occur from thermal cycling of components with different Coefficients of Thermal Expansion (CTEs).
Mitigating downstream integration risk is a mission-critical aspect of any new MEMS sensor product cycle. By deploying comprehensive, fully-coupled FEA simulation, engineers can optimize designs for robustness while accounting for system-level effects, ultimately avoiding catastrophic performance degradation during downstream integration of devices into complete systems.
Each selected presenter will receive:
- One complimentary pass to MEMS & Sensors Executive Congress US 2017
- Table on which to display your demo during lunch at MEMS & Sensors Executive Congress US, to give attendees a closer look
- Product featured in a pre-event media advisory, which will also include your product photo. This media advisory tends to be a favorite among press so you have an excellent chance of getting press coverage on your product—even before the Showcase starts!
- Potential greater visibility among media attending the event