MEMS & Sensors Executive Congress—MSEC 2018

MEMS & Sensors Executive Congress—MSEC 2018

Sunday, Oct 28 – Tuesday, Oct 30, 2018
08:00 AM – 05:00 PM
Sunday, Oct 28, 2018 to Tuesday, Oct 30, 2018
Silverado Resort and Spa
1600 Atlas Peak Road
Napa, California, United States - 94558

MEMS & Sensors Executive Congress—MSEC 2018                            

October 28–30, 2018
Silverado Resort & Spa
Napa, California

SENSOR SYSTEMS ENABLING AUTONOMOUS MOBILITY 

Join the top thinkers in MEMS and sensors as they break down the challenges facing the industry and shed light on the many new and emerging business opportunities.

The list of amazing new products incorporating MEMS and sensor devices is growing rapidly. Applications are wide and varied—from beds that monitor heart rates and breathing, to agricultural devices that measure sunlight, soil pH, and moisture content, to products aimed at enhancing athletic performance. The list goes on and on, growing daily with nearly limitless potential.

The MEMS & Sensors Executive Congress is the only event where industry executives can exchange ideas and information while networking with partners, customers, and competitors—all in an exquisite destination like California’s legendary Napa Valley!
 

ATTEND MSEC TO...

  • LEARN About the Global MEMS and Sensors Supply Chain

  • NETWORK with Leading Customers, Partners, and Suppliers from these companies

  • GROW Your Business with the MEMS & Sensors Industry Group (MSIG) Members 

 

TECHNOLOGY SHOWCASE AT MSEC 2018

The Technology Showcase highlights the newest and most unique MEMS and sensors-enabled applications in the industry, giving startups, established companies, and R&D innovators the opportunity to demonstrate their inventions to MSEC attendees and the press

See the MSEC 2018 Technology Showcase Finalists!

  • ALERTGY
  • N5 SENSORS
  • NXP ASSET TRACKING
  • SCORCHED ICE
  • SPORTFITZ

 


Who Should Attend

  • Business Development Professionals
  • Developers
  • Device Manufacturers
  • Engineer Managers
  • Equipment and Material Suppliers
  • Executives
  • Foundries
  • Integrators
  • Product Managers
  • Researchers

MSEC 2018 SPEAKER SELECTION COMMITTEE


Contact

Conference Programming & Logistics
Michelle Fabiano, IOM
Tel: +1.310.-930.7669
mfabiano@semi.org

Sponsorship Opportunities
Eric Rude
Tel: +1.408. 943.7047
erude@semi.org

 

 

SUNDAY, OCTOBER 28

1:00–5:00pm

SENS/MACH 2018 *
Not included in the MSEC registration fee. Click here to register for SENS/MACH 2018.

5:30–7:00
Registration and Welcome Reception

MONDAY, OCTOBER 29

7:30–8:30am
Registration and Breakfast
8:30–8:40
Welcome

Dave Anderson
President, SEMI Americas

8:40–9:00
Opening Remarks

Dave Kirsch
Chair, MEMS and Sensors Industry Group Governing Council, and
Vice President and General Manager, EV Group

9:00–9:45

SESSION 1: MEMS & SENSORS GO MOBILE

Session Chair: Venkataraman Chandrasekaran
Principal Engineer, Knowles 

9:45–10:15

Autonomous and Electric Cars: What’s in for Conventional MEMS & Sensors 

Jérémie Bouchaud
Director and Senior Principal Analyst, MEMS & Sensors, IHS Markit

10:15–10:45
BREAK
10:45–11:15

Sensing for Autonomous Mobility

Nicolas Sauvage
Sr. Director-Ecosystems Marketing, ​TDK-InvenSense

11:15–11:25
TECHNOLOGY SHOWCASE OVERVIEW

TECHNOLOGIES FOR MOBILITY    

Stephen Whalley
CEO, Strategic World Ventures

11:25–11:35

Asset Tracking Demo Using Motion Sensors

Sahil Choudhary
Technical Marketing and Enablement Manager, IoT Sensors, ​NXP Semiconductors

11:35–11:45
11:45–11:55

Smart Skates

Bruce Wright
Director Engineering, Scorched Ice 

11:55–12:05
12:05–12:15
12:15–2:00

Lunch and Technology Showcase Demonstrations

SESSION 2: VOICE AS A NEW INTERFACE FOR AUTONOMOUS MOBILITY

Session Chair: Michelle Bourke—MSEC Committee
Strategic Marketing Director, Customer Support Business Group, Lam Research 

2:00–2:30
2:30–3:00
3:00–3:30

Voice Interfaces and Edge Processing

Matthew Cowan
Sr. Director, Solutions and Ecosystems, Knowles

 

3:30–4:00
BREAK
4:00–4:30

Unawearables: New Wearable Sensors and Circuits for Unobtrusive Health and Fitness Monitoring

Patrick Mercier
Associate Professor of Electrical and Computer Engineering, and Co-founder/Co-director of the Center for Wearable Sensors, ​University of California, San Diego

 

4:30–5:00

Sensor Innovations in Wine-Grape Vineyards and Wineries

Greg La Follette
Winemaker, Alquimista Cellars

5:00–5:15
Closing Remarks

Carmelo Sansone
Director, SEMI–MSIG

5:15–6:00
BREAK
6:00–8:00
Alquimista Cellars Wine Tasting and Dinner
8:00–9:30
Post Dinner Cocktail Reception

TUESDAY, OCTOBER 30

7:30–8:30am
Breakfast
8:30–8:45
Day 2 Kick-off Remarks

Carmelo Sansone
​Director, ​SEMI–MSIG

8:45–9:30

KEYNOTE: Rapid Innovation with Production MEMS Workshop Outbrief

Ron Polcawich PhD ​
Program Manager, ​DARPA Microsystems Technology Office

SESSION 3: AUTONOMOUS MOBILITY APPLICATIONS

Session Chair: Nicole Kerness PhD —MSEC Committee Member
Vice President Sensor Design, Technology, and Advanced Development, Kionix 

9:30–10:00

Status, Challenges, and Opportunities of the 2018 MEMS & Sensors Industry

Guillaume Girardin PhD
Director, Photonics, Sensing and Display Division, Yole Developpement

10:00–10:30
BREAK
10:30–11:00
11:00–11:30

It’s Time for Wearables to Revolutionize Healthcare

Craig Easson
Managing Director, Industrial & Healthcare Business Unit, ​Maxim Integrated

 

Sudir Mulpuru
Executive Business Manager, Maxim Integrated 

11:30–12:00

Sensors in Food and Agriculture

David Mount
Senior Advisor, Consultant, ULVAC Technologies

12:00–1:30
LUNCH
1:30–2:00

Environmental Sensors Systems Enabling Autonomous Mobility

Marcellino Gemelli
Director of Global Business Development, ​Bosch Sensortec

2:00–2:30

Chirp Microsystems: Bringing MEMS Ultrasonic Sensing to Everyday Products

Michelle Meng-Hsiung Kiang, PhD
CEO, Chirp Microsystems, A TDK Group Co. 

2:30–3:15
Closing Remarks and Awards


MEMS & SENSORS INDUSTRY GROUP HALL OF FAME AWARD
Presented by Carmelo Sansone, Director, SEMI–MSIG, and
David Kirsch, Chair, MEMS & Sensors Industry Group Governing Council, and Vice President and General Manager, EV Group

MEMS & SENSORS TECHNOLOGY SHOWCASE WINNER
Presented by Carmelo Sansone, Director, SEMI–MSIG, and
Stephen Whalley, CEO, Strategic World Ventures 

 

WEDNESDAY, OCTOBER 31

10:00–12:00 noon
OPTIONAL—Bevan Cellars, Tench Vineyard Winery Tour*

7631 Silverado Trail, Napa 94558
* Transportation Not Provided

CLICK HERE to RSVP for the Bevan Cellars Tench Vineyard Winery Tour 

 

 

 

 

Agenda as of Oct 11, 2018. Subject to Change

 

Oct. 9 to Onsite
SEMI-MSIG Members $1395
Non-members $1860

CANCELLATION POLICY

  • Cancellations received on or before October 9, 2018, will be fully refunded.
  • Cancellations after October 9, to Onsite, only substitutions are accepted with a written note from the registered attendee.  

 

 

SILVERADO RESORT & SPA

1600 Atlas Peak Road
Napa, California 94558
US Toll-Free: +1.800.532.0500
Tel: +1.707.257.5440

The Silverado Resort & Spa is a luxury resort in the heart of the world-famous Napa Valley Wine Country. Located just an hour north of San Francisco, it’s tucked away from the city while still being close to the Bay Area action. The hotel includes a full-service spa, two PGA championship golf courses, 13 lighted tennis courts, plus biking and hiking trails to ensure extracurricular interest for everyone. Its location is close to more than 400 Napa Valley wineries. The elegant styling and picturesque Northern California views make it one of the most sought-after and beautiful destinations to visit for vacation or business.

RESERVE A ROOM.

Special Hotel Rates for MSEC are closed. Please contact the Silverado Resort & SpaTel: +1.707.257.5440, to make a reservation. 

DIRECTIONS to the Silverado Resort & Spa
 

TRAVEL OPTIONS TO THE SILVERADO RESORT & SPA

(Time is approximate depending on the time of day)

SFO (San Francisco International Airport)

  • 62 miles from SFO to Silverado

OAKLAND (OAK)

  • 56 miles from OAK to Silverado

SACRAMENTO (SMF)

  • 67 miles from SMF to Silverado

 


QUESTIONS?
Michelle Fabiano, IOM
Program & Event Manager, SEMI
mfabiano@semi.org 

 

 

Sponsorship Opportunites:

Eric Rude
Tel: +1.408. 943.7047
erude@semi.org

Featured Sponsors

 

Call for Abstracts: MSEC 2018

 

IMPORTANT DATES

Deadline for Abstracts:
July 6, 2018
 

Notification of Acceptance:
August 10, 2018
 

Final Presentation Due for Review:
October 1, 2018

 

The MEMS & Sensors Industry Group (MSIG) and 2018 MSEC Speaker Selection Committee invite you to submit an abstract for either or both of these areas:

  1. Speaker. An abstract for a paper to present a TechTalk (TedTalk format)
  2. Demonstration in the MSEC Technology Showcase (sample of 2017 Technology Showcase)
 
 

Sensor Systems Enabling Autonomous Mobility

The theme of the MEMS & Sensors Executive Congress (MSEC) 2018 is Sensor Systems Enabling Autonomous Mobility.”  Autonomous Mobility is often thought about when discussing vehicles, yet it can equally apply today when we consider wearables, the point of care medical devices, food delivery and agriculture platforms and remote monitoring systems such as environmental, weather, energy, industrial IoT, etc. MSEC 2018  will focus on system-level solutions for these areas incorporating MEMS/sensor and actuators, unique applications and innovative technological or market solutions. Speakers will elucidate unique application requirements, system level architecture, integration challenges and how to manage and overcome them successfully. We are inviting topics from across the entire MEMS/sensors supply chain as it pertains to the impact Autonomous Mobility will have. 

 
 

As the premier information-gathering and networking conference for industry stakeholders, MSEC brings together 200+ executives, product managers, business development professionals, and engineering directors from the MEMS and sensors value chain, and attracts leading industry analysts and media. This year’s conference will take place on Sunday—Tuesday, October 28–30, at the exclusive Silverado Resort in Napa Valley, California.

 
 

How to Submit an Abstract

To submit an abstract, complete the ONLINE FORM and upload your abstract (100-250 words) describing the topic of your presentation and how it applies to the MEMS & Sensors industry. There is no fee for submission. SEMI MSIG members will receive priority consideration.

 

MEMS & Sensors Executive Congress 2018 Speaker Selection Committee

Mike Rosa, Applied Materials

Uma Krishnamoorthy, Bosch

Marcellino Gemelli, 
Bosch Sensortec

André Rouzaud, CEA-Leti,
Technology Research Institute

Craig Ensley, Innovative Micro Technology (IMT)

Rajashree Baskaran, Intel

Nicole Kerness, Kionix

Venkataraman Chandrasekaran, Knowles

Michelle Bourke, Lam Research

Collin Twanow, Micralyne

Silvia Garre, NXP

Ian Campbell, Onscale

Evgeni Gusev, Qualcomm Technologies

 

Topic Areas

We are seeking abstracts addressing MEMS & Sensors breakthroughs and innovations in, but not limited to, the following:

  • Autonomy in Private and Public Transportation for Land, Sea, and Air
  • Wearable Devices for Sport, Fitness, and Medical Uses
  • New Sensor-based Hardware Additions to Mobile Phones and Tablets
  • MEMS-based Displays and Projectors for mobile/remote applications
  • Environmental Sensing
  • Sensors in Food and Agriculture
  • Mobile and Remote Monitoring IOT applications
  • 5G and Autonomous Mobility
  • AI, Machine Learning, and Sensing for Autonomous Mobility
  • MEMS/Sensor Supply Chain Implications of Autonomous Mobility
  • Emerging Technologies, R&D and Investment Trends in Autonomous Mobility
     
     

    Presentation & Submission Guidelines

    Presentations must include practical recommendations for addressing commercialization issues. Preference will be given to applications providing innovative technological or market solutions driven by a particular use-case along with its integration challenges and system-level architecture decisions. Applications should feature unique requirements such as power efficiency, computational capabilities, wireless interconnectivity, and data management. Presentations should cover how each challenge was addressed and overcome.

    • Abstracts should clearly outline a path forward and articulate a call-to-action.
    • Commercial or marketing presentations will not be accepted.
    • Speakers will receive discounted admission to MSEC 2018. No other compensation will be provided.
    • Speakers will be required to sign an agreement, provide a bio and headshot by July 6, and provide an electronic copy of his or her presentation by October 1, 2018.
    • All final presentations will be made available to conference attendees and MSIG members.
     
     

    Benefits of Presenting

    Be recognized as a leader in our exciting and growing industry. Selected presenters will receive:

    • Acknowledgment in the onsite MSEC 2018 Event Guide
    • Listed as speaker in the agenda on the conference website
    • MSEC proceedings
    • Discounted MSEC registration fee.
     
     

     

      
     

    Questions?
    Please contact:
    Michelle Fabiano, IOM
    Program & Event Manager, SEMI
    mfabiano@semi.org

      
        

    MSEC 2018 TECHNOLOGY SHOWCASE

    Meet the Innovators—See the Products—Vote for a Winner!

    The Technology Showcase highlights the newest and most unique MEMS and sensors-enabled applications in the industry. It gives startups, established companies, and R&D innovators the opportunity to demonstrate their inventions to MSEC attendees and the press

     

    ALERTGY

    GLUCOSE MONITOR & ALERT SYSTEM

    Alertgy’s Glucose Monitor is a biosensor-based wristband device that provides non-invasive, real-time blood glucose monitoring for diabetics. The device provides both patients and healthcare professionals on-demand access to blood glucose levels via a smartphone application. READ MORE


     

    N5 SENSORS

    LOW-POWER GAS SENSING PLATFORM

    N5 Sensors’ Micro-Scale Gas Sensors on a Chip enable low-power, high-reliability microscale gas and chemical sensing technologies in small-footprint devices. The chip promises to broaden the implementation of gas and chemical sensing for industrial detection, first response, smart cities, demand-controlled ventilation, wearables, and other consumer electronics. READ MORE

     

     

    NXP

    ASSET TRACKING DEMO USING MOTION SENSORS-- NXP VIDEO     

    NXP Semiconductor’s Asset Tracking Technology uses motion sensors, GPS and edge computing for precision tracking of a package’s journey from origin to the delivery point. The technology enables logistics companies to quickly pinpoint and resolve transportation issues. READ MORE

     

     

    SCORCHED ICE

    SMART SKATES

    Scorched Ice Inc.’s Smart Skates leverage STMicroelectronics’ inertial measurement unit (IMU) sensors to facilitate real-time diagnostics of a hockey player's skating technique, condition, and performance. The device provides actionable insights to players, coaches, trainers, and scouts.  READ MORE

     

     

    SPORTFITZ

    CONCUSSION–MONITORING DEVICE—SPORTZFITZ VIDEO

    SportFitz’s Concussion-Monitoring Device combines real-time measurements of location, position, direction, and force of impact as well as big data analytics and embedded protocols to stream data that can help assess potentially concussive brain impacts. The one-inch wearable device is hypoallergenic, waterproof, recyclable, reusable and rechargeable. 

     

     

    THE MSEC PUBLICITY PROGRAM

    WHAT IS IT?

    The MSEC Publicity Program

    • Gives you access to our MSEC press attendee list and press briefing information.

    • Meet with the press in our onsite press room.

    • Publish your MSEC–related press releases and other company news to the SEMI Member section of the SEMI website.

    • Submit your press releases here.  See below for a SEMI Boilerplate for your Press Releases. 

       

    PRESS LIST

    We register press to attend MSEC and will be adding more editors over the coming weeks.

    Use the press list to invite the press to briefings with your company spokespeople. By mid-October, we will provide background information on press, to help you tailor your pitches/invitations accordingly. You can also pitch article ideas to editors who accept contributed articles.

     

    PRESS ROOM INFORMATION

    Work and meet with the press in a comfortable, convenient meeting space for your media briefings during MSEC. You are welcome to bring your company’s press information to the press room. Tables in the press room are available on a first–come, first–served basis.

    ONSITE PRESS ROOM: Beringer Room

    LOCATION: Go down the stairs (located across the hall from the main conference room) and follow the signs to the Beringer Room.  

    PRESS ROOM HOURS:

    • Monday, October 29    7:00am–6:00pm

    • Tuesday, October 30   7:00am–4:00pm
       

    MSIG PRESS RELEASES AND POSTS  

     

    SOCIAL MEDIA

     

      

    • Stay current on the latest on MSEC and other MSIG PR Partner opportunities. Join MSIG PR Partners on LinkedIn 

    • Visit the SEMI Blog

    • Follow us on Twitter!   

    BOILERPLATE FOR YOUR PRESS RELEASES

    About SEMI

    SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance, FlexTech, the Fab Owners Alliance (FOA) and MEMS & Sensors Industry Group (MSIG) are SEMI technology communities. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

    Trademark Statement

    The SEMI logo is a registered trademark, and MEMS & Sensors Industry Group and the MEMS & Sensors Industry Group logo are trademarks of SEMI. 

     

    MSIG PR CONTACT AND PRESS ROOM MANAGER

    Contact us, the MEMS & Sensors Industry Group—MSIG for:

    • MSEC publicity program

    • MSIG quote for your press release

    • Inquire about any other PR opportunities with MSIG

    Please contact Maria Vetrano, Vetrano Communications, at MSIG PR.

     

     

    THANK YOU TO OUR MEMS & SENSORS EXECUTIVE CONGRESS MEDIA PARTNERS 

    SEMI is proud to partner with the following media and associations to bring you news about this event. Click below to subscribe or learn more about them.


     

     3D INCITES is an online media resource that covers the whole advanced packaging conversation from heterogeneous integration to the IoT, MEMS, sensors, and more. As a community, 3D InCites brings to life the people, the personalities, and the minds behind these technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation. Subscribe at www.3dincites.com.
     

    AZONANO is the leading online publication for the nanotechnology community; educating a worldwide audience of researchers, engineers, and scientists with the latest industry news, information, and insights from the Nanotechnology industry. Visit www.azonano.com.

     BODO'S POWER SYSTEMS is the Magazine for Power Electronics Engineers. Launched in June 2006, Bodo’s Power Systems magazine provides technical articles for systems design engineers in Power Electronics, Power Management, Power Conversion, and Intelligent and Embedded Motion Control. Serving now about 40000 subscribers, worldwide, in English, it is in print 12 times a year, available via www.bodospower.com, and in two basic e-newsletters every month.
     CHIP SCALE REVIEW is the preeminent global magazine leading the way in middle-end and back-end technologies for advanced semiconductors covering device & wafer-level test, assembly & packaging. For over 20 years Chip Scale Review has continued to showcase industry leaders with exclusive editorial content that includes in-depth technical articles by leading industry technologists, market forecasts and updates from veteran industry analysts, research institutions, industry news, events, and reviews. Also featured are international directories of equipment manufacturers, materials suppliers, and service providers. Chip Scale Review also co-organizes the visionary International Wafer-Level Packaging Conference (IWLPC) with the SMTA. Sign up or renew your free subscription at www.ChipScaleReview.com.
     
     CIRCUITS ASSEMBLY is the leading magazine exclusively serving the electronics assembly market. It covers surface-mount and mixed-technology; lead-free production and compliance; materials; screen printing; component placement; soldering; rework; test and inspection; process control; data management and more. The magazine’s 32,000 subscribers consist of executives, process engineers, EMS providers, and OEMs. For a free subscription, visit www.circuitsassembly.com.
     
     EMSN0W is the global information source for the electronics manufacturing industry. Comprised of both a website and daily newsletter, the goal of EMSNow is to provide compelling, high quality, topical content to a focused audience, delivering views and results for our advertisers. Visit www.emsnow.com to subscribe.
     
     GLOBAL SMT & PACKAGING is the world’s leading technical magazine serving the electronics manufacturing industry, publishing a monthly international print edition, supported by quarterly China and South East Asia editions. The magazine also publishes websites, a daily newsletter and regional newsletters in China, Germany, South East Asia and the United Kingdom/Ireland. Complementing the traditional media products, Global SMT & Packaging produces a series of Masterclass Webinars and weekly video programs, as well as panel discussions and interviews from major trade shows around the world. Visit www.globalsmt.net to subscribe or download the app.
     
     HEALTH TECH INSIDER is a website and weekly email newsletter that publishes information about mobile and wearable products and services for health and medical applications, as well as about enabling technologies such as printed electronics, sensors, energy harvesting, and wireless communications. Visit www.healthtechinsider.com for more information.
     
     The MEMS AND NANOTECHNOLOGY EXCHANGE (MNX) provide a full range of services from design, prototype development and fabrication to low-volume manufacturing in all industry areas. We offer thousands of unique process technologies in a state-of-the-art cleanroom and expert assistance from PhD level MEMS engineers. We’ve helped with nearly 3,000 custom projects since 1999. Visit our websitewww.mems-exchange.org.
     
     MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association whose members consist of semiconductor suppliers, manufacturers, and individuals committed to enhancing the competitiveness of the back-end portion of the semiconductor business. MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry. Visit www.meptec.org.
     
     MEXICO EMS is an e-newsletter that focuses on the electronics assembly industry in Mexico. Published weekly in Spanish, it reports on all phases of electronics assembly process – from screen printing thru component placement and final test and inspection – as well the materials and equipment used in these processes.  Mexico EMS also reports on the people who impact this market. Visit www.mexicoems.com
     
     MIPI ALLIANCE offers a comprehensive portfolio of specifications to interface chipsets and peripherals in mobile-connected devices. The specifications can be applied to interconnect a full range of components—from the modem, antenna and application processor to the camera, display, sensors, and other peripherals. Manufacturers use the specifications to optimize performance, simplify the design process, reduce development costs, create economies of scale for their designs, and shorten time-to-market for their products. Visit www.mipi.org.
     
     PHOTONICS MEDIA is the leading information resource in the photonics industry.  Our flagship publication, Photonics Spectra magazine, covers the science and industry of photonics.  It promotes an international dialogue among the engineers, scientists and end users who develop, commercialize and buy photonics products.  Our newest publication, Industrial Photonics, covers lasers, sensors, machine vision and automation systems for materials processing, process control, and production.  It is written for manufacturing, production, design and applications engineers, researchers and others involved in the integration of photonics technologies across a range of operations. www.photonics.com
     
     PRINTED CIRCUIT DESIGN & FAB is the leading magazine serving the PCB design and fabrication markets. It covers the latest PCB design and fabrication technologies, techniques, processes and market conditions. The magazine's 30,000 subscribers include engineers, designers, managers, executives and fabricators at OEMs, design service bureaus and merchant/captive fabrication facilities, and their suppliers. PCD&F is free to qualified professionals. To subscribe, visit www.pcdandf.com.
     
     SEMICONDUCTOR PACKAGING NEWS is a daily e-mail newsletter & website reaching over 200,000 readers. SPN covers the world of semiconductor packaging and micro-electronics, publishing important industry news articles. We package this information into a convenient newsletter that we deliver to our subscribers via e-mail at no cost. We deliver over 1,000 white paper downloads every month and you'll also find commentaries, cartoons, an industry event calendar and much more. Visit www.semiconductorpackagingnews.com.
     
     SENSORS ONLINE is the primary source for design and product engineers seeking information about the latest sensor technologies, sensor-related technologies, and industry market trends. Each day, the industry’s premier resource covers the latest news from IoT to Artificial Intelligence, Medical, Automotive, Industrial, and more. Sensors Online offer a plethora of design resources and reference materials such as newsletters, white papers, tutorials, educational videos, and webinars hosted by industry experts in an array of disciplines. Visit www.sensorsmag.com.
     
     SOLID STATE TECHNOLOGY is the longest-running and most complete source of information for engineers, operators, managers, tool and materials suppliers, and semiconductor researchers. Solid State Technology covers semiconductor manufacturing, advanced packaging, wafer fabrication, integrated circuits, thin-film microelectronics, flat-panel displays, and microstructure technologies, processes and equipment and more. Learn more at www.electroiq.com/index/Semiconductors.html.
     
     SOUTH EAST ASIA EMS is an e-newsletter that reports the news of the electronics industries in South East Asia. Published twice monthly, it reports on the various processes, equipment, and materials used in backend packaging, MEMS, flex, and board assembly. South East Asia also reports on the people who impact this market. Subscribe at seasiaems.com.
     
     Engineers turn to TECH BRIEFS FIRST for new design ideas and solutions to their toughest manufacturing challenges. In addition to reporting the best of NASA’s inventions available for commercialization, Tech Briefs has expanded its editorial coverage to include innovative new technologies from other sources within the vast network of federal laboratories — the Department of Energy, Department of Defense, and many more — as well as universities and commercial companies worldwide. Sign up today for a FREE subscription at www.techbriefs.com/subscribe/NTB/ZSEMI2018.
     
     Over the past 26 years, U.S. TECH has become the major publication for the electronics industry. We report fresh news and emphasize coverage of new products and services that can help technology in the U.S. to continue to thrive. U.S. Tech has expanded its reach to Canada, Mexico, Europe, and China. We participate in all major trade conferences to further expose the publication, its advertisers, and the products and services it covers to an ever-expanding readership of decision makers. Visit www.us-tech.com.
     
     WHAT’S NEW IN ELECTRONICS has been created to provide a hub of information for the Electronics industry. Completely unique in its approach, WNIE is a platform where subscribers can view the latest news on products & services, download technical data, white papers, view appointments, find new contacts via the industry directory, and more. www.wnie.online
     
     YOLE DÉVELOPPEMENT has grown to become a group of companies providing marketing, technology, and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS & Sensors, RF Electronics, Image Sensors, and Optoelectronics. Visit www.i-micronews.com.