MEMS & Sensors Executive Congress2017

       
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**PLEASE NOTE**  Due to the devastating wildfires that have affected the Napa, California area, MSEC has relocated to the Hayes Mansion located at 200 Edenvale Ave, San Jose, CA 95136.  The dates, times and agenda remains as noted here.

MSEC17 has an exciting line-up of speakers and activities, be sure to register for the event.  To contribute to relief efforts in Northern California, visit here.

 
   

November 1-2, 2017
Hayes Mansion
San Jose, California

MEMS & SENSORS SYSTEMS: CREATING SIXTH SENSES

     

    The MEMS & Sensors Executive Congress is the only MEMS & Sensors event where executives have the opportunity to sit with end-user customers to exchange ideas and information, engage with competitors, plus network and relax with colleagues. Join MEMS and sensor industry experts as they break down the challenges and opportunities of the industry.

    • LEARN about the global MEMS and sensors supply chain

    • NETWORK with leaders within the MEMS and sensors market

    • GROW your business with the MEMS & Sensors Industry Group

     

     

    KEYNOTES

      

     

      
     

    “For learning and networking, the MEMS and Sensors Executive Congress is a one-of-a-kind venue for global technology players in this important industry sector. The event provides us with a valuable forum for discussions with customer decision makers, while also connecting us with companies throughout the broader MEMS and sensors ecosystem.”

    K H Koh
    Vice President, MEMS Business
    Advanced Micro-Fabrication Equipment Inc. (AMEC)

     

    The list of amazing new products incorporating MEMS and sensor devices is growing rapidly. Applications are wide and varied from beds that monitor heart rate and pressure points for bed sore prevention to agricultural devices that measure sunlight, soil pH, and moisture content to products aimed at enhancing athletic performance such as golf, tennis, and basketball and list goes on and on.

    Who's Coming to MSEC (as of October 18)

    • 2 The Point Advisors
    • 3D InCites
    • A.M.Fitzgerald & Associates
    • ACUTRONIC USA
    • Advanced Energy Industries
    • Advanced Micro-Fabrication Equipment
    • Airgas USA
    • Analog Devices
    • Applied Materials
    • Artiman
    • Asia Pacific Microsystems
    • Aspencore
    • Arizona State University
    • Bosch
    • Bosch Sensortec
    • Brewer Science
    • C2MI
    • Cactus Semiconductor
    • Case Western Reserve University
    • Coventor
    • Dow Electronic Materials
    • DUNAN SENSING
    • DutchSprouts / SoilCares
    • EE Journal
    • EE Times
    • EETech Media
    • eLichens
    • EV Group
    • Extension Media
    • Flex
    • Fraunhofer IPMS - Institut für Photonische Mikrosysteme
    • Hillcrest Laboratories

     

     

    • Honeywell Defense & Space
    • IEEE Spectrum
    • Infineon Technologies AG
    • Innovative Micro Technology (IMT)
    • Integrated Device Technology, Inc. (IDT)
    • Intel Corporation
    • Invensense
    • Kaplan Breyer Schwarz IP Law
    • Kionix
    • Knowles
    • KSEC
    • Lam Research
    • LEIF Technologies
    • Maven Machines
    • Maxim Integrated
    • MCA
    • mCube
    • MegaChips Corporation
    • memsstar Limited
    • MEMStaff
    • Menlo Micro
    • Merit Sensor Systems
    • Micralyne
    • Nada Technologies
    • Nanomedical Diagnostics
    • NXP Semiconductors
    • NXP Semiconductors Germany GmbH
    • OEM Group
    • OHMEGA TECHNOLOGIES INC
    • Okmetic
    • Omron
    • Phoenix Silicon International Corporation

     

    • PNI Sensor Corporation
    • Proteus Digital Health
    • Qualcomm
    • Rave
    • Reuters
    • Robert Bosch
    • Robert Bosch Research and Technology Center North America (RTC)
    • Rogue Valley Microdevices
    • Silex Microsystems
    • SITRI Group
    • Si-Ware Systems
    • SoftMEMS
    • SPEA
    • Sperling Media Group
    • SPTS Technologies
    • SPTS Technologies (An Orbotech Company)
    • Strategic World Ventures
    • SÜSS MicroTec SE
    • TDK InvenSense
    • Techfocus Media
    • Tecnisco
    • Tekscan
    • Teledyne DALSA
    • TSMC
    • ULVAC Technologies, Inc.
    • USound
    • Vesper Technologies
    • Vetrano Communications
    • VTT Technical Research Centre of Finland Ltd.
    • Woodside Capital Partners
    • X-Fab Semiconductor Foundries AG
    • Yole Développement

     

      MEMS & Sensors Executive Congress 2017 Speaker Selection Committee

      • Craig Ensley
        Innovative Micro Technology (IMT)
         
      • Evgeni Gousev
        Qualcomm Technologies
         
      • Jason Weigold
        MEMStaff
         
      • Jeff Hilbert
        2 The Point Advisors

       

       

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