MEMS & Sensors Executive Congress2017

       
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Due to the devastating wildfires that have affected the Napa, California area, MSEC will be relocated to the Hayes Mansion located at 200 Edenvale Ave, San Jose, CA 95136

MSEC has an exciting line-up of speakers and activities, be sure to register for the event. The SEMI staff thanks you.

 
   

November 1-2, 2017
Hayes Mansion
San Jose, California

MEMS & SENSORS SYSTEMS: CREATING SIXTH SENSES

     

    The MEMS & Sensors Executive Congress is the only MEMS & Sensors event where executives have the opportunity to sit with end-user customers to exchange ideas and information, engage with competitors, plus network and relax with colleagues. Join MEMS and sensor industry experts as they break down the challenges and opportunities of the industry.

    • LEARN about the global MEMS and sensors supply chain

    • NETWORK with leaders within the MEMS and sensors market

    • GROW your business with the MEMS & Sensors Industry Group

     

     

     

    KEYNOTES

       
       

     

    WHO SHOULD ATTEND

       
     
    • Executives
    • Product Managers
    • Business Development Professionals
    • Product/Engineering Managers

    See who attended in 2016: Attendee Demographics

    Executives, product managers, business development professionals, and product/engineering managers from the MEMS & Sensors supply chain including integrators, device manufacturers, foundries, equipment and material suppliers, researchers, developers and other related fields benefit from MSEC. 

     
      

    The list of amazing new products incorporating MEMS and sensor devices is growing rapidly. Applications are wide and varied from beds that monitor heart rate and pressure points for bed sore prevention to agricultural devices that measure sunlight, soil pH, and moisture content to products aimed at enhancing athletic performance such as golf, tennis, and basketball and list goes on and on.

    Presentations will focus on system level solutions incorporating MEMS and/or sensor device, unique applications and innovative technological or market solutions. Integration challenges and system level architecture decisions are driven by the particular use-case.  Each application has its own unique requirements which may include power efficiency, computational capability, wireless interconnectivity, and data collection, interpretation, and encryption. Speakers will elucidate these challenges and how to manage and overcome them successfully.

     

    Who's Coming to MSEC

    • 2 The Point Advisors
    • 3D InCites
    • A.M.Fitzgerald & Associates
    • Acutronic USA
    • Advanced Energy Industries
    • Analog Devices
    • Applied Materials
    • Asia Pacific Microsystems
    • Aspencore
    • Bosch
    • Bosch Sensortec
    • Brewer Science
    • Cactus Semiconductor
    • Case Western Reserve University
    • Coventor
    • DUNAN SENSING
    • EE Journal
    • EE Times
    • EETech Media
    • eLichens
    • EV Group
    • Extension Media
    • Flex
    • Flexible Electronics
    • Fraunhofer IPMS - Institut für Photonische Mikrosysteme
    • Hillcrest Laboratories
    • Honeywell Defense & Space
     
    • IEEE Spectrum
    • IHS Markit
    • Infineon Technologies 
    • Innovative Micro Technology
    • Integrated Device Technology, Inc. (IDT)
    • Intel
    • Invensense
    • Kionix
    • Kionix
    • KSEC
    • Lam Research Corporation
    • LEIF Technologies
    • Maven Machines
    • Maxim Integrated
    • mCube
    • MegaChips
    • memsstar Limited
    • MEMStaff
    • Menlo Micro
    • Merit Sensor Systems
    • Nada Technologies
    • Nanomedical Diagnostics
    • NXP
    • NXP Semiconductors Germany GmbH
    • OEM Group
    • Ohmega Technologies
    • Okmetic Oy
    • Phoenix Silicon International Corporation

     

    • Proteus Digital Health
    • Pzflex
    • Qualcomm
    • Rave LLC
    • Reuters
    • Robert Bosch
    • Robert Bosch Research and Technology Center North America (RTC)
    • Rogue Valley Microdevices
    • Silex Microsystems
    • SITRI Group
    • Si-Ware Systems
    • SoilCares BV
    • SPEA
    • Sperling Media Group
    • SPTS Technologies (An Orbotech Company)
    • SÜSS MicroTec SE
    • TDK InvenSense
    • Techfocus Media
    • TECNISCO
    • Tekscan
    • TSMC
    • USound
    • Vesper
    • Vetrano Communications
    • VTT Technical Research Centre of Finland
    • Woodside Capital Partners
    • Yole Développement

     

      MEMS & Sensors Executive Congress 2017 Speaker Selection Committee

      • Craig Ensley
        Innovative Micro Technology (IMT)
         
      • Evgeni Gousev
        Qualcomm Technologies
         
      • Jason Weigold
        MEMStaff
         
      • Jeff Hilbert
        2 The Point Advisors

       

       

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