MEMS and Sensors – Reliability for Devices, Packaging and Interconnects in Wearable Technology

MEMS and Sensors – Reliability for Devices, Packaging and Interconnects in Wearable Technology

Wednesday, Jan 24, 2018
08:00 AM – 09:00 AM
Wednesday, Jan 24, 2018
at 08:00 AM to at 09:00 AM
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Online Webinar, United States


Abstract:  The focus of this webinar is the reliability of MEMS and Sensors in wearable systems.  For the purpose of this talk, the system includes the device, it’s packaging, and the interconnect.  The entire systems hierarchy must all be well designed, processed and without killer defects.  This webinar will cover some of the newer MEMS and sensor devices with advanced packaging and flexible interconnects for wearable technologies, and how to assess and model reliability.



Agenda

8:00 - 8:05
Frank Shemansky, SEMI, MSIG CTO
8:05 - 8:45
Allyson Hartzell, ScM, Veryst Engineering, Managing Engineer
8:45 - 9:00
Q & A