Tianshui Huatian Technology Co., Ltd.

Tianshui Huatian Technology Co., Ltd.

Street Address: 
No. 14 ShuangQiao Road
Tianshui
Gansu
China
741000
Web Site Address: 
Company Description: 

可封装DIP、SIP、SOP、SSOP、TSSOP、QFP、LQFP、ELQFP、QFN、DFN、BGA、LGA、MCM(MCP)、TSV-CSP、SiP、SOT、TO等10余个系列185个集成电路封装品种。年封装能力90亿块,封装成品率≥ 99.90%。可进行5寸、6寸、8寸、12寸等晶圆测试盒多块集成电路并行测试,年测试能力60亿块。Providing more than 10 series (85types) of package, including DIP, SIP, SOP, SSOP, TSSOP, QFP, LQFP, ELQFP, QFN, DFN, BGA, LGA, MCM(MCP), TSV-CSP, SiP, SOT, TO, and etc. Assembly Capacity is 8.5 Bu/ Year, with Assembly Yield ≥ 99.90%. Also providing chip probing (5’’- 12’’) and IC testing, with the capacity of Bu/ Year.

Company ID: 
180344
Join Date: 
Nov 6, 2014
Address Map: 
Primary Industry: 
Semiconductor
Primary Product Category: 
Device Manufacturing
Primary Product Sub Category: 
Contract Manufacturing (OSAT)