Siltectra GmbH

Siltectra GmbH

Street Address: 
Manfred-von-Ardenne-Ring 7
Dresden
Germany
D-01099
Web Site Address: 
Company Description: 

Siltectra has developed its kerf-free “Cold Split” process to replace wire sawing of wafers from boules or ingots as well as back-grinding of processed semiconductor wafers, so called thinning. Compared to wire sawing, CS significantly improves economics by avoiding material waste, which translates in almost double the amount of wafers per grown SiC boule.

Company ID: 
252667
Join Date: 
Aug 15, 2017
Address Map: 
Primary Industry: 
Semiconductor
Primary Product Category: 
Equipment and Sub-systems
Primary Product Sub Category: 
Silicon Substrate Manufacturing Equipment