ProTec Carrier Systems GmbH (PCS) is a young, highly innovative company specialized in the development, production, and marketing of systems and components for processing and handling of thin and ultra-thin substrates for e.g. thin wafer, glass and foil. These applications are designed for the semiconductor, plastic (flexible) electronic, photovoltaic, and Display industries in form of the worldwide patented Transfer ElectroStatic Carrier (T-ESC®) Technology, which is a temporary bonding system and works without adhesiive use, as well as Electrostatic Chuck (e-chuck) Technology. PCS enlarged its application portfolio in the field of III/V semiconductors, display, plastic electronic, and photovoltaic technology. Advanced process steps require additional substrate support in order to work reliably. Thus, based on using electrostatic clamping force (Coulomb force) the T-ESC® Technology is a good means to accomplish such a temporary support in an economical way. Furthermore, electrostatic clamping of thin foils for e.g. OPV (Organic PV) or OLED applications will improve the process results by enabling cooling possibilities, especially in vacuum processes. Manufacturing tools can be enhanced by introducing PCS’s electrostatic substrate holders instead of vacuum or mechanical clamping devices. The company, founded in 2008, has its premises in Siegen, Germany.