PacTech USA

PacTech USA

Street Address: 
328 Martin Ave
Santa Clara
CA
United States
95050-3112
Web Site Address: 
Company Description: 

Pac Tech designs and builds the worlds leading wafer bumping equipment for flip-chip, chip-scale packaging, and MEMS devices based on electroless metallization. The Pac Tech facility in Santa Clara, California offers contract wafer bumping and solders ball placement, product demonstrations, training, and sales support.

Company ID: 
4291
Join Date: 
Jun 28, 2005
Address Map: 
Primary Industry: 
Semiconductor
Primary Product Category: 
Equipment and Sub-systems
Primary Product Sub Category: 
Assembly/Packaging Equipment