Optim Wafer Services

Optim Wafer Services

Street Address: 
Z.I. des Pradeaux
Gréasque
France
F-13850
Web Site Address: 
Company Description: 

We are providing Wafer Services : Thinning by Grinding (Taiko process available), Dicing (Dicing Before grinding as well available), Edge trimming, Edge beveling Wafer Bonding, Chemical Mechanical Polishing and Cleaning, Downsizing wafers (ex : 300mm down to 200mm), Wafer Reclaim. We assist customers and run DOE's to tune a process flow to their requirements

Company ID: 
22301
Join Date: 
Apr 15, 2016
Address Map: 
Primary Industry: 
Semiconductor
Primary Product Category: 
Services
Primary Product Sub Category: 
Manufacturing Services