Nidec-Read Corporation has dedicated to deliver electrical inspection systems for PWB and Semiconductor package industry. Applying the established technologies, Nidec-Read also develops semiconductor inspection systems. Our primary products, RWi series are Semiconductor Wafer Bump 2D/3D Inspection System which is realized fully integrated simultaneous 2D/3D & High-Speed Scanning to measure Gold, Solder μ and Cu Pillar Bumps. MEMS spring probe manufacturing line will also become a good solution for micro bump inspection. Please feel free to contact and find our solutions.