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Advanced Semiconductor Packaging and Test, System Integration, Embedded Packaging Technologies. Concept and Design, Packaging, Assembly and Test Development, Engineering and Manufacturing Services, NANIUM is Wafer-Level Package Solution Provider, both Fan-In WLP/ WLCSP and Fan-Out WLP/ WLFO, WLSiP and WL3D. NANIUM is the largest OSAT/ Packaging, Assembly and Test Foundry in Europe (20.000m² clean room, around 600 employees, capacity for more than 4,000 wafer/ carrier starts (300mm diameter) per week. NANIUM history started in 1996 as Backend FAB of Siemens Semiconductors, later Infineon Memory Products and Qimonda.