Mitsubishi Heavy Industries Machine Tool Co,. Ltd.

Mitsubishi Heavy Industries Machine Tool Co,. Ltd.

Street Address: 
130, Rokujizo,
Ritto
Shiga
Japan
520-3080
Web Site Address: 
Company Description: 

Mitsubishi Room-temperature Wafer Bonder "BOND MEISTER" Theroom-temperature bonding technique, which holds bonding materials (wafers)together by activating their surfaces in a vacuum, can provide strongbonding without applying heat. The use of room-temperature bonding hasprimarily been used in the field of sealed packaging for MEMS (MicroElectro Mechanical Systems), but because this technique can be applied todiverse materials, it has recently been used in fields other than MEMS,such as light-emitting and radio-frequency (RF) devices. Mitsubishi HeavyIndustries Machine Tool Co., Ltd. (MAT) has released a line ofroom-temperature bonders applicable to different wafer sizes for variouspurposes, ranging from research and development (R&D) to device massproduction. The company is also trying to expand the application fields ofroom-temperature bonding by providing various kinds of bonding supportservices.

Company ID: 
268463
Join Date: 
Jun 1, 2002
Address Map: 
Primary Industry: 
MEMS
Primary Product Category: 
Equipment and Sub-systems
Primary Product Sub Category: 
Substrate Conditioning