Meister Abrasives AG

Meister Abrasives AG

Street Address: 
Industriestrasse 10
Andelfingen
Switzerland
CH-8450
Web Site Address: 
Company Description: 

Meister Abrasives high precision grinding wheels are developed to provide highest performance, world class quality and consistency on semiconductor products. We manufacture application and customized engineered solutions for all types wafer thinning of Semiconductor materials including Si, GaAs, Ge, SiC, Sapphire, GaN, AlN, LiNbO3 or LiTa on all type of standard (back-)grinding tools (DISCO, ACCRETECH, Strasbaugh, Okamoto...)Other Materials: -AlTiC for Hard Disk Read/Write Heads -Super hard poly crystalline compound materilas (SiN, SiC, AlN) -Quarz and Glasses Applications: -IC Back grinding including ultra thin wafers -TSV’s / MEMS / SOI -TAIKO grinding -Dicing before grinding (DBG) -Edge bevel grinding of stacked wafers -Various packaging processes like eWLP and others -Wafer Reclaim grinding

Company ID: 
175801
Join Date: 
Dec 20, 2008
Address Map: 
Primary Industry: 
Semiconductor
Primary Product Category: 
Materials
Primary Product Sub Category: 
Other