Engineers and manufacturers of Sockets, boards, and systems for burn-in and test applications. Sockets for QFN, Multiple Row QFN, CSP, BGA, LGA, Jedec TO, SIP, DIP, Flatpack, Microwave, Optical, and other packages. Standard pitches from 0.25 – 2.54mm, open-top or clam-shell. Optional designs include heat sinks, Non-Magnetic, Kelvin, and Non-Kelvin contacting and other custom features. “Smart Sockets” for high frequency and high current applications.