LatticeGear provides cleaving solutions, used to prepare samples in the laboratory, that offer high productivity and throughput, and enable customers to obtain superior analytical results. Its cleaving tools and accessories that offer a low cost-of-ownership (COO) with a high return on investment for the semiconductor, solar and general materials markets. Customers are able to seamlessly turn whole wafers into prepared samples that are suitable for analysis using scanning electron microscopy (SEM), atomic force microscopy (AFM), surface analysis and optical-based equipment, or for further sample preparation in a focused ion beam (FIB), broad beam polishing / milling, or using mechanical tools. LatticeGear’s flagship product, the patent-pending LatticeAx™, features a new ‘Indent and Cleave’ methodology that bridges the gap between manual scribing and fully automated cleaving. It addresses the market need for uniform, repeatable, accurate and high-quality cleaving results at lower capital and COO costs. For more information visit: www.latticegear.com. .