JIPAL CORPORATION is a professional agent for packaging equipment & materials headquartered in Hsin-Chu ,Taiwan. The company was founded in 1990. JIPAL provides leading-edge service combine with customer’s needs. Our branch in Hsinchu,Taichung,Kaohsiung,Hong Kong, Shanghai,Tianjin,Leshan,Suzhou,Shenzhen and Singapore. Product:Allteq:Die Coater & Post W/B Inspection. Aurigin:Advanced Solder Ball Placement.Furukawa:UV Tape for Dicing, Grinding & Sawing tape & Laser Wafer Dicing tape. Hitachi:LOC Mounter & Die Bonder. Hitachi(TOHKEN): X-Ray Inspection. IKK: New Module Trim/Form System.Kinergy:QFN buffing Machine.Okamoto:Wafer Back Grinder & Polisher for thin wafer. PAL:Ni/Au line and copper plating line for BGA Substrate.Teikoku:Wafer Mounter & Taper/Detaper. Towa :Auto Molding System, Compression molding system, Singulation System. ALPHA:Flux, Solder Paste, Solder Sphere.KCC: Epoxy Molding Compound.