Finetech offers precision die bonders for micro assembly and advanced packaging -- flip chip, VCSELs, laser bars & diodes, sensors, photonics packaging, MEMs, Chip to Wafer, Cu pillar, and Chip on Glass. A high degree of process flexibility within one platform makes these systems ideal for R&D or prototype environments -- thermo-compression, thermo-sonic, eutectic, epoxy, ACF & Indium bonding. Manual, motorized and automated models available, with sub-micron placement accuracy. Engineering collaboration and customization for complex and novel applications. Finetech also provides advanced BGA rework systems for today’s most challenging applications.