E+H manufactures manual and automated instruments to measure wafer thickness, flatness, warp, stress, resistivity, P/N. E+H instruments use contactless (capacitive) sensors. Automated sorters and systems using robots are available. Member of German 300mm initiative. Special solutions to measure very thin wafers and GaAs. New SECS/GEM interface. E+H products are affordable, fast and reliable. Contact our sales partners: www.jpkummer.com (Europe), www.hologenix.com (USA), www.chunson.com (Taiwan).