Session 4: Markus Schindler, Ph.D.
Wednesday February 14, 2018 at 10:50 AM
Markus Schindler, Ph.D.
Product Manager, DELO Industrial Adhesives
Novel Materials for MEMS Packaging
MSTC 2018 Session 4: MATERIALS & CHARACTERIZATION
Wednesday February 14, 2018 ~ 10:50 - 11:20 AM
About Markus Schindler, Ph.D.
Dr. Markus Schindler, born in 1984, graduated in physics at Technical University in Munich where he also earned his doctor’s degree in the field of experimental polymer physics in 2014. He joined DELO in 2014. As a Product Manager for adhesives used in MEMS and sensors, he is responsible for new products and processes in microelectronic packaging.
In many MEMS-based devices, stress decoupling is of maximum importance in order to avoid temperature-induced stress, i.e. on the membranes of pressure sensors. DELO’s latest generation MEMS die attach adhesives reach a Young’s modulus of less than < 1 MPa at room temperature and < 10 MPa even at -40 °C. Stress decoupling can even be pushed to extremes by placing the MEMS die on only four flexible pillars, rather than on one continuous adhesive bead. DELO’s material is capable of building extremely high aspect ratios for optimum stress decoupling. The patented chemistry used also allows for an optional light prefixation of the dispensed adhesive to avoid unwanted spreading or bleeding before placement of the MEMS die and the final heat curing step (B-stage process). In addition, DELO has developed new materials for ASIC die coating. Exposing the ASIC die to IR radiation leads to unwanted signal noise, especially in MEMS microphones. Made of silicon, the ASIC die is transparent to IR radiation. Hence, all five open sides of the die need to be shielded against IR (five face coating). DELO has developed materials with tailored dispensing and flow behavior for this application. These adhesives are optimized for jet dispensing, still leaving the freedom to adjust the layer thickness to the needs of the application. The coating covers the five faces very well while minimizing the spread on the substrate, keeping the footprint small.