By Laith Altimime, president, SEMI Europe
The SEMI Europe team and I are energized about the programs we’ve been building, and we hope that you will join us on our journey by attending some of these upcoming events in the next six months.
The countdown for our European Imaging & Sensors Summit and European MEMS & Sensors Summit has begun. On 20-22 September, the doors of the Minatec will open in Grenoble, France to host the best summit dedicated to imaging, MEMS and sensors technologies. The inaugural Imaging and Sensors program includes top level speakers and a common track with the co-located MEMS & Sensors Summit organized in collaboration with SEMI Strategic Association Partner, MEMS & Sensors Industry Group (MSIG). The exhibition is fully booked! The program includes a dedicated session for startups. Sign up now to learn and network at this co-located event, which closes with a joint session.
Our next goal? Empowering Innovation and Shaping the Value Chain at SEMICON Europa 2017 (14-17 November). Co-located with productronica in Munich for the first time, the global exposition will expand attendee opportunities to exchange ideas and promote technological progress, featuring the most advanced and innovative electronics manufacturing platform in Europe. The Opening Ceremony offers three keynotes:
- Maria Marced, president, TSMC Europe
- Stefan Finkbeiner, CEO, Bosch Sensortec
- Frank M. Rinderknecht, founder and CEO, Rinspeed Inc.
Free Webinar related to SEMICON Europa 2017 will be organized; please save the date for the Material Webinar (27 September, 5:00pm). More information will follow soon; check SEMI Europe events.
After a successful Member Forum in Tel Aviv last June, SEMI Europe is now pleased to invite you to the SEMI Member Forum on 7-8 December in Dresden, Germany. Keeping talent in Europe’s industry is a key enabling factor for future growth of the microelectronics industry. Focused on talent management and industry growth in Europe, this unique event (organized by SEMI Europe in collaboration with Fraunhofer IPMS) will strengthen your connections with global industry leaders.
Another successful flagship event is back: the European 3D Summit 2018 will take place on 22-24 January 2018 in Dresden, Germany. This 6th edition of the Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology, plus 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies to create Heterogeneous Integration and High Density Systems for different applications. Registration is open!
Also, please mark your calendars for ISS Europe 2018, taking place on 4-6 March in Dublin. A refreshed format will provide insight into a wide range of areas enabling global competitiveness.
We hope to meet you at one or more of those events. As always, please read about our upcoming events here: SEMI Europe events.
President, SEMI Europe
September 12, 2017