Session 16: Encapsulation & Coating
Bringing Permeation Barrier Technology to Application: From Ultra-High Barrier Films to Functional Films for Flexible Electronics
Wednesday, June 21, 2017
4:20 PM - 4:40 PM
Permeation barrier films and coatings attract continuous interest for the encapsulation of flexible organic electronic devices. Recent developments reported water vapor transmission rates in the 10-5 g/(m²d) level and below for barrier coated polymer webs. However, processing conditions – both during barrier film coating and subsequent processes – have substantial influence on barrier performance, reproducibility and applicability of the films. This is especially true for continuous roll-to-roll processing in an application relevant pilot or production environment.
This paper – presenting results from the European Projects PI-SCALE and SMARTONICS – discusses roll-to-roll vacuum coating and processing of ultra-high permeation barrier films. It evaluates the influence of the machine configuration and web winding parameters as well as web substrate quality on defect and particle formation and barrier performance of oxide and nitride barrier films both during barrier coating itself and during subsequent deposition of a transparent electrode on the barrier film. Under proper processing conditions, even sputtered single layer barriers allow water vapor transmission rates in the range of 10-4 g/(m²d) (at 38°C / 90% r.h.) in a pilot scale roll-to-roll process at 650 mm web width. Potential for improving the performance further by adding wet coated planarization layers will be discussed . Furthermore application performance and barrier device interaction will be discussed for the example of flexible OLED lighting panels prepared in a roll-to-roll vacuum evaporation process.
John Fahlteich was born in 1981 in Lutherstadt Wittenberg, Germany. He graduated from the University of Leipzig with a diploma in physics in 2005. After that he worked as PhD student and scientist at the Fraunhofer Institute for Electron Beam and Plasma Technology, Dresden. In 2010, John earned a PhD from the Technical University of Chemnitz with a thesis about a detailed characterization of vacuum deposited permeation barrier layers. In total, he has now over 10 years of experience in the field of thin film technology, vacuum deposition techniques, permeation barriers and encapsulation of flexible electronics. Since 2010, John has been working as project manager and expert for permeation barriers at Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP.