Jeongwon Park - Nanocarbon Contacts in Flexible Electronics Applications

Session 21: Novel Conductor and Semiconductor Materials

Nanocarbon Contacts in Flexible Electronics Applications
Thursday, June 22, 2017 
11:20 AM - 11:40 AM

Integrated nanoelectronic devices on flexible substrates can offer enhanced functionality than silicon-based devices for advanced wearable technology. Carbon nanotubes (CNTs) and graphene are potential candidate materials for flexible hybrid electronics applications, due to their tolerance to electromigration under high current densities and excellent electrical, thermal, and mechanical properties. However, the long-term performance of these nanocarbons and their interfaces with other materials need better understanding for device functionalization and implementation for practical applications. Toward this end, we study an all-carbon nanostructure as a potential building block for various flexible electronic device applications.

We compile existing published results on all-carbon nanostructures, including their use as interconnects. Such structure consists of vertically aligned CNTs grown directly on graphene, using the same plasma-enhanced chemical vapor deposition method as for graphene. We examine the key performance characteristics of the 3-D CNT/graphene nanostructure pertinent to potential applications in flexible chips. Combining with electrical measurements and Raman spectroscopy, analyses of high-resolution TEM images of CNT/graphene interface nanostructures provide the necessary knowledge for continuous improvements of the fabrication process and to reduce contact resistance. In addition, we investigate the structural integrity of the all-carbon nanostructures under various mechanical stretching conditions for its suitability in flexible device applications. Encapsulation or packaging techniques for the all-carbon nanostructures to enable their operations as flexible sensors will be developed for eventual device functionalization. Our study will provide the necessary knowledge for evaluating these nanostructures for flexible hybrid integration, which is vital for developing high-performance sustainable materials for the flexible electronics industry.

 

Speaker's Biography

Jeongwon Park joined the University of Ottawa, as an Associate Professor at the School of Electrical Engineering and Computer Science in July 2016. His expertise is in the areas of nanotechnology-enabled flexible hybrid electronics, nano-photonics, emerging nano-electronics, III-V semiconductor, Silicon CMOS device fabrication, and ‘beyond-CMOS’ devices with low-dimensional nano-materials including CNT and graphene. Prior to that, Jeongwon was a scientist at SLAC National Accelerator Laboratory, Stanford University from 2014 to 2016. At SLAC, he developed and implemented nanofabrication and microfabrication methods for advanced x-ray optics and nano-photonic devices at the Stanford Nano Center, Stanford Nanofabrication Facility, and SLAC National Accelerator Laboratory.

Dr. Park has worked closely with different industrial partners. For six years, he served as a senior technologist to support the corporate Chief Technology Officer (CTO) and business units at Applied Materials, US. He also actively worked with Semiconductor Research Corporation (SRC) as an industrial mentor, liaison and proposal reviewer for overall SRC research strategies.

Jeongwon has been a guest researcher at the Lawrence Berkeley National Laboratories (LBL, NCEM), a visiting scholar in the Department of Electrical Engineering at Stanford University, and an adjunct professor in the Department of Electrical Engineering at Santa Clara since 2009. He received his Ph.D. (2008) in Materials Science and Engineering from the University of California, San Diego. During his Ph.D., he focused on nano-electronics with carbon nanotubes and organic field effect transistors including fabrication within a clean room, experience with CMOS, MEMS, packaging, device processing/measurements, simulations and modeling tools. Jeongwon's current research interests include nano-technology-enabled flexible hybrid electronics and sensors.

 


SPEAKER
Jeongwon Park
University of Ottawa