Jan Vardaman - Challenges and Opportunities for 3D Printed Electronics

Session 11: Direct Write & 3D Printing II

Challenges and Opportunities for 3D Printed Electronics
Wednesday, February 14, 2018
1:30 PM - 1:55 PM

There are advantages in using 3D printed electronics are for prototyping, lower cost, and unique manufacturing applications. Work continues in the area of ink development with many desired materials still in development. Because the industry is still in its early stages of growth for electronics applications, reliability data is limited. A major advantage of 3D printed electronics is that in-house proprietary designs never leave the building. This allows rapid innovation, experimentation with complex geometries not available in another way, flexibility, customization, security, and fast time-to-market. Limitations include droplet sizes that are not compatible with Front End Semiconductor Processes, but are compatible with Back End Semiconductor Processes (BEOL) which need features from tens of microns to millimeters. Inks with similar conductivities to traditional electronic metals are required for printed circuit applications. Mixing conductive materials with polymers to make conductive inks can result in a higher resistivity. Some conductive metals are susceptible to oxidation unless protected during processing. This presentation examines material trends and takes a look at the applications driving the adoption of 3D printed electronics.

 

Speaker's Biography

E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE CPMT (now EPS) and is an IEEE CPMT (EPS) Distinguished Lecturer. She is a member of SEMI, IMAPS, and MEPTEC. She received the IMAPS GBC Partnership award in 2012. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium

 


SPEAKER
Jan Vardaman
President
TechSearch International, Inc.