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SEMI Publishes White Paper: Reporting on the Material Composition of Semiconductor Manufacturing Equipment, Subassemblies, and Components SEMI recently published an industry White Paper entitled, "Reporting on the Material Composition of Semiconductor Manufacturing Equipment, Subassemblies, and Components". The Paper summarizes the value of harmonized approaches for disclosing hazardous materials. The White Paper, Published in October 2008 (in Adobe PDF format) is located here: http://www.semi.org/en/issues/ehs/ctr_026919 The White Paper references a SEMI Materials Declaration Form Template, which is located here: http://www.semi.org/en/issues/ehs/ctr_026918
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