Plenary 2: Applications & Markets II
Printing Thermally Stable Conductors using Low Temperature Processing for Power Electronics, RF, & UAV Applications
Tuesday, February 13, 2018
11:35 AM - 12:00 PM
Bringing Materials to Market requires designing for reliability at the onset. This talk will present some recent work to fabricate 3D Printed electronics that can sustain higher current densities than printed silver in order to enable printed power electronics and 3D or Flexible RF antennas. Such high powers cause diffusion in printed silver traces which leads to unintended changes in performance and premature failures. This talk presents a technique to create high temperature conductors using only low temperature processing. Chemical energy can be stored within the ink particles which is only released during photonic annealing to produce a high temperature conductive alloy able to sustain high power densities in power electronics and RF applications. This work leveraged a collaboration between Johns Hopkins University, Harvard University, and Draper.
Greg Fritz joined the Charles Stark Draper Laboratory in 2015 where he has worked on product solutions using additive manufacturing, degradable electronics, and thermoelectrics. He received his Ph.D. in Materials Science from the Johns Hopkins University in 2011 focusing on the solid state ignition of self-propagating intermetallic reactions. Upon graduation, Greg joined the staff at the IBM T.J. Watson Research Center in Yorktown Heights, NY. His research at IBM consisted of advanced metallization materials and processes for the 10nm, 7nm, and 5nm nodes as well as integrating reactive foils in the BEOL for integrated circuit tamper detection and response. Greg has been granted 13 U.S. Patents, has 12 peer reviewed publications and was selected for the 2017 Class of US Frontiers of Engineering by the National Academy of Engineering.