Global Packaging Material Outlook

Global Semiconductor Packaging Materials Outlook to 2021, coming soon!

A comprehensive study that examines the semiconductor packaging materials markets

Publication Date: New updated version to be available in Dec. 2017
Principal Analysts: Dr. Dan Tracy of SEMI and E. Jan Vardaman of TechSearch Inc.
Number of pages: 120+
Format: Microsoft® Excel® (.xls) and PowerPoint (.ppt) and Adobe® .pdf (includes three files)

Overview

 

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified; new opportunities are highlighted for advanced technology nodes and emerging package form factors; and forecasts through 2021 are presented. 

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability and cost of semiconductors, and offer significant improvement potential.

 

  Request a Sample ( 2015 Report Executive Summary)

 

Product Information

Features 
  • Technology trends
  • Regional market size
  • Five-year market forecast to 2021
  • Market size in revenue and units
  • Concise Executive Summary
  • Excel workbook file summarizing market information
  • Supplier market share
  • Capacity and utilization trends

Benefits

  • Gain insight to worldwide packaging material technology trends, market size and marekt forecast
  • Understand key package offerings and technologies
  • Use benchmark data to validate business opportunities and assumptions
  • Improve business analysis and empower your market research with verified, validated, and credible data

 

Purchase Global Semiconductor Packaging Materials Outlook - New update to 2021 will be available in November 2017

Product ID#Product Description

Member*          

Non-Member       
3566Global Semiconductor Packaging Materials Outlook to 2021 -Single-user$5,000$6,000
3567Global Semiconductor Packaging Materials Outlook to 2021 - Multi-user$12,500$15,000

*Pricing does not apply to Individual Members.
For product related inquiries or questions regarding Enterprise pricing, please email mktstats@semi.org or call 1.877.746.7788.

Other Related Reports

Worldwide OSAT Manufacturing Site Databas

 

Table of Contents

EXECUTIVE SUMMARY 
1 INTRODUCTION 
1.1 Methodology 
1.2 Assumptions 
1.3 Report Organization 

2 SEMICONDUCTOR PACKAGING AND INDUSTRY TRENDS 
2.1 Semiconductor Trends - Industry Markets 
2.2 Semiconductor Trends - Regional and Market Issues 
2.3 Packaging Materials Needs – Customer Input 
2.4 Packages and Electronic End-market Applications 

3 SUBSTRATES 
3.1 Laminate Substrates 
3.2 Build-up Substrates 
3.3 Organic Substrate Technology Trends 
3.4 Organic Substrate Material Markets and Forecasts 
3.5 Organic Substrate Pricing 
3.6 Organic Substrate Supply 
3.7 Flex Circuit/Tape Substrates 

4 LEADFRAMES 
4.1 Leadframe Market and Technology Trends 
4.2 Leadframe Markets 
4.3 Leadframe Market Forecasts 
4.4 Leadframe Supply 

5 BONDING WIRE 
5.1 Bonding Wire Market and Technology Trends 
5.2 Bonding Wire Markets 
5.3 Bonding Wire Pricing 
5.4 Bonding Wire Market Forecasts
5.5 Bonding Wire Supply 

6 Mold Compounds
6.1 Mold Compound Technology Trends 
6.2 Mold Compound Markets 
6.3 Mold Compound Market Forecasts
6.4 Mold Compound Supply

7 UNDERFILL MATERIALS 
7.1 Capillary Underfill (CUF) 
7.2 Molded Underfill (MUF) 
7.3 Non-conductive Paste (NCP) 
7.4 Non-conductive Film (NCF) 
7.5 Underfill Technology Trends 
7.6 Underfill Material Market 
7.7 Underfill for Packages 
7.8 Underfill 

8 Liquid Encapsulants 
8.1 Liquid Encapsulant Technology Trends 
8.2 Liquid Encapsulant Markets 
8.3 Liquid Encapsulant Market Forecasts 
8.4 Liquid Encapsulant Supply 

9 DIE ATTACH MATERIALS 
9.1 Die Attach Technology Trends 
9.2 Die Attach Markets 
9.3 Die Attach Market Forecasts 
9.4 Die Attach Supply 

10 SOLDER BALLS 
10.1 Solder Ball Material Technology Trends 
10.2 Solder Ball Market and Forecast 
10.3 Solder Ball Supply 

11 WATER LEVEL PACKAGE
11.1 Wafer Level Package Dielectrics Technology Trends 
11.2 Wafer Level Package Dielectrics Market and Forecast 
11.3 Wafer Level Package Dielectrics Supply 

12 Plating Chemicals
12.1 Plating ChemicalsTechnology Trends
12.2 Plating Chemicals Material Development
12.3 Plating Chemicals Market and Forecast
12.4 Plating Chemicals Material Supply

13 SUMMARY AND CONCLUSIONS
13.1 Acknowledgements 

 

14 APPENDICES

 

Purchase Global Semiconductor Packaging Materials Outlook - New update to 2021 will be available in November 2017

Product ID#Product Description

Member*          

Non-Member       
3566Global Semiconductor Packaging Materials Outlook to 2021 -Single-user$5,000$6,000
3567Global Semiconductor Packaging Materials Outlook to 2021 - Multi-user$12,500$15,000

*Pricing does not apply to Individual Members.
For product related inquiries or questions regarding Enterprise pricing, please email mktstats@semi.org or call 1.877.746.7788.

 

Methodology

In-person interviews with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.

Other Reports

Worldwide OSAT Manufacturing Site Database

Material Market Data Subscription (MMDS) 
World Fab Forecast
World Fab Watch

 

About SEMI
SEMI®  connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

About TechSearch International, Inc. 
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market developments.