Influence FO-PLP Standards Development at SEMICON West
The SEMI Fan-Out Panel Level Packaging (FO-PLP) Panel Task Force is focused on helping the industry define a single panel substrate dimension for fan-out manufacturing. This definition will allow the industry to concentrate work on the development and improvements in processing that will lead to superior cost and performance improvements of fan-out technologies in high volume.
Please join us in a three-hour working session at SEMICON West on Wednesday, July 11 from 1:00 PM – 4:00 PM in the San Francisco Marriott Marquis Hotel to define a standard panel size for panel level fan out processing. If you are not the appropriate person to join us, please feel free to forward this to the right person from your company.
In the early 1970s, each semiconductor device manufacturer used its own standard wafer dimensions, requiring home-grown tool sets. The first standard published by SEMI defined the dimensions for a 2-inch wafer. This standard, which has since evolved into SEMI M1, was instrumental in the growth of the tool industry and concentrated efforts on process improvements. The industry needs to follow a similar blueprint by creating a panel standard to bring panel scale fan-out to high-volume manufacturing.
Today, there are LCD, PCB, wafer level, and high-density interconnect tool sets being used for fan-out panel level processing and a chaotic industry landscape has emerged. Whether chip first or chip last, whether on substrate or on carrier, the SEMI Standards FO-PLP Panel Task Force believe that standardization of a single panel size across a plethora of different materials will enable a single toolset to become a reality for panel fan out processing.
Have your say in the creation of a panel standard to bring panel scale fan-out into high volume manufacturing – and determine how the proposed standards will impact your development roadmaps. The draft that emerges from this meeting will go to ballot this fall.
Help make semiconductor industry history and bring the next generation of electronics to the world!
To attend this meeting, in person or via teleconference, please contact Laura Nguyen, SEMI Standards Staff, at firstname.lastname@example.org.
June 14, 2018