FlexTech Invites Proposals for Development of Flexible Power, and Flexible & Printed Electronic Components

FlexTech Invites Proposals for Development of Flexible Power, and Flexible and Printed Electronic Components

Milpitas, Calif. – April 7, 2017 - FlexTech, a SEMI strategic association partner, is currently accepting responses to its Request for Proposals (RFP) for revolutionary and evolutionary flexible power solutions, flexible hybrid electronic components, printed electronics and integration of these components. In addition, the RFP welcomes proposals for a benchmark study on the field of printed electronics. FlexTech anticipates making multiple awards to teams or individual organizations involved in the field, who have  research and development capability in the U.S.  Proposals are due May, 17, 2017 at 5:00 PM PDT.

FlexTech’s uniquely-structured team of the Technical Council and Governing Council will provide evaluation, prioritization, review and management of the proposals and resulting projects. FlexTech plans to grant and administer funding which will be matched with funds in the form of cash and in-kind contributions provided by the grant recipients to cover the total project cost. Historically, cost share for the development program has averaged over 60% industry funding.

In prior programs, FlexTech has found that greater advancements are made when respondents are able to partner to capture expertise in outside organizations. Thus, in responding to this solicitation, partnering is encouraged among industry, R&D organizations and university teams to develop comprehensive and integrated solutions. Individual company responses are appropriate where company size, breadth and expertise are sufficient to cover all areas (e.g., technical resources, financial stability, and market presence) critical to the successful completion of the proposal.

FlexTech seeks to support technical approaches that are revolutionary or have a more significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by FlexTech are in the U.S. Government’s Technology Readiness Level (TRL) 3-6 and Manufacturing Readiness Level (MRL) 1-3 levels.

For more information and to understand all requirements and categories of proposals, please review the full RFP, available here.

About SEMI

SEMI® connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

About FlexTech

FlexTech, a SEMI Strategic Association Partner, is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible hybrid electronics, by developing solutions for advancing these technologies from R&D to commercialization. Visit FlexTech at www.flextech.org and follow FlexTech on LinkedIn and Twitter.