FE Standards

Flexible Electronics Standards

SEMI
Standards

     

IPC
Standards

     

IEC
Standards

     

ISO
Standards

     

ASTM
Standards

     

TAPPI
Standards

 

Please contact SEMI Standards (FHEstandards@semi.org) if you would like to suggest standards to add to this website. 

 


SEMI Standards

This is a resource, not an exhaustive list, of possible relevant standards. Please visit http://www.semi.org/en/Standards for a full list of standards. 

Get involved with Flexible Electronics Standards at SEMI! Contact FHEstandards@semi.org today. 

  • 3D-IC (3D) - 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications
  • Flat Panel Display (D) - D8 - Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
  • Equipment Automation Hardware (E)
    • E6 - Guide for Semiconductor Equipment Installation Documentation
    • E12 - Guide for Standardized Pressure, Temperature, Density, and Flow Units Used in Mass Flow Meters and Mass Flow Controllers
    • E16 - Guide for Determining and Describing Mass Flow Controller Leak Rates
    • E17 - Guide for Mass Flow Controller Transient Characteristics Tests
    • E18 - Guide for Temperature Specifications of the Mass Flow Controller
    • E27 - Guide for Mass Flow Controller and Mass Flow Meter Linearity
    • E28 - Guide for Pressure Specifications of the Mass Flow Controller
    • E35 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment
    • E43 - Guide for Electrostatic Measurements on Objects and Surfaces
    • E45 - Test Method for the Determination of Inorganic Contamination from Minienvironments Using VPD-TXRF, VPD-AAS, or VPD/ICP-MS
    • E46 - Test Method for the Determination of Organic Contamination from Minienvironments Using Ion Mobility Spectrometry (IMS)
    • E49 - Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies
    • E51 - Guide for Typical Facilities Services and Termination Matrix
    • E66 - Test Method for Determining Particle Contribution by Mass Flow Controllers
    • E67 - Test Method for Determining Reliability of Mass Flow Controller
    • E68 - Test Method for Determining Warm-Up Time of Mass Flow Controllers
    • E69 - Test Method for Determining Reproducibility and Zero Drift for Thermal Mass Flow Controllers
    • E72 - Specification and Guide for Equipment Footprint, Height, and Weight
    • E78 - Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment
    • E79 - Specification for Definition and Measurement of Equipment Productivity
    • E108 - Test Method for the Assessment of Outgassing Organic Contamination from Minienvironments Using Gas Chromatography/Mass Spectroscopy
    • E116 - Specification for Equipment Performance Tracking
    • E124 - Guide for Definition and Calculation of Overall Factory Efficiency (OFE) and Other Associated Factory-Level Productivity Metrics
    • E137 - Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment
    • E140 - Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
    • E141 - Guide for Specification of Ellipsometer Equipment for Use in Integrated Metrology
    • E149 - Guide for Equipment Supplier-Provided Documentation for the Acquisition and Use of Manufacturing Equipment
    • E150 - Guide for Equipment Training Best Practices
    • E165 - Guide for a Comprehensive Equipment Training System When Dedicated Training Equipment is not Available
    • E176 - Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment
  • Equipment Automation Software (E) - Entire Volume 
  • Facilities (F) - Entire Volume 
  • Materials (M)
    • M56 - Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
    • M59 - Terminology for Silicon Technology
  • MEMS (MS) - Entire Volume
  • Packaging (G)
    • G66 - Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
    • G73 - Test Method for Pull Strength for Wire Bonding
    • G79 - Specification for Overall Digital Timing Accuracy
    • G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending
    • G71 - Specification for Barcode Marking of Intermediate Containers for Packaging Materials
    • G83 - Specification for Bar Code Marking of Product Packages
  • Photovoltaic (PV)
    • PV56 - Test Method for Performance Criteria of Photovoltaic (PV) Cells and Modules Package
    • PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC)
    • PV77 - Guide for Calibration of Photovoltaic (PV) Module UV Test Chambers
    • PV78 - Test Method for Bending Property of Flexible Thin Film Photovoltaic (PV) Modules
    • PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic
  • Process Chemicals (C)  - Entire Volume
  • Safety Guidelines (S)  - Entire Volume
  • Traceability (T)
    • T12 - Specification for Tracing Jigs and Implements
    • T13 - Specification for Device Tracking: Concepts, Behavior, and Services
    • T18 - Specification of Parts and Components Traceability
    • T19 - Specification for Device Marking
    • T21 - Specification for Organization Identification by Digital Certificate Issued from Certificate Service Body (CSB) for Anti-Counterfeiting Traceability in Components Supply Chain

 


IPC Standards

This is a resource, not an exhaustive list, of possible relevant standards. Please visit http://shop.ipc.org/standards for a full list of standards 

  • IPC/JPCA-2291, Design Guideline for Printed Electronics (2013)

  • IPC/JPCA-4591, Requirements for Printed Electronics Functional Conductive Materials

  • IPC/JPCA-4921, Requirements for Printed Electronics Base Materials (Substrates)

  • IPC/JPCA-6901, Application Categories for Printed Electronics

  • IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) (2016)

  • IPC-2292, Design Standard for Printed Electronics on Flexible Substrates

  • IPC-9204, Guideline on Flexibility & Stretchability Testing for PE

  • IPC-9691B (IPC-TM-650), User Guide for the IPC-TM-650, Method 2.4.3 – Sliding parallel plate test

 


IEC Standards

This is a resource, not an exhaustive list, of possible relevant standards. Please visit https://webstore.iec.ch/home for a full list of standards 

  • IEC 62899-202  Materials - Conductive ink à sheet resistance
  • IEC 62899-403-1  Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
  • IEC 62899-502-1 Quality assessment - Organic light emitting diode (OLED) elements - Mechanical stress testing of OLED elements formed on flexible substrates

 


ISO Standards

This is a resource, not an exhaustive list, of possible relevant standards. Please visit https://www.iso.org/store.html for a full list of standards 

  • ISO 4287, Dimensional and geometrical product specifications and verification
  • ISO 489, Plastics - Determination of refractive index
  • ISO 15106, Plastics - Film and sheeting - Determination of water vapour transmission rate

 


ASTM Standards

This is a resource, not an exhaustive list, of possible relevant standards. Please visit https://www.astm.org/ for a full list of standards 

  • F1896, Test Method for Determining the Electrical Resistivity of a Printed Conductive Materia
  • D522, Test Methods for Mandrel Bend Test of Attached Organic Coatings
  • D2861, Test Methods for Flexible Composites of Copper Foil with Dielectric Film or Treated Fabrics
  • E290, Test Methods for Bend Testing of Material for Ductility
  • F1683, Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component
  • D696, Test Method for Coefficient of Linear Thermal Expansion of Plastics
  • D1505, Standard Test Method for Density of Plastics by the Density-Gradient Technique
  • E96/E96M, Standard Test Methods for Water Vapor Transmission of Materials
  • C623, Standard Test Method for Young's Modulus, Shear Modulus, and Poisson's Ratio for Glass and Glass-Ceramics by Resonance
  • D882, Standard Test Method for Tensile Properties of Thin Plastic Sheeting
  • D7490, Standard Test Method for Measurement of the Surface Tension of Solid Coatings, Substrates and Pigments using Contact Angle Measurements
  • E384, Standard Test Method for Microindentation Hardness of Materials
  • D7127, Standard Test Method for Measurement of Surface Roughness of Abrasive Blast Cleaned Metal Surfaces Using a Portable Stylus Instrument
  • D542, Standard Test Method for Index of Refraction of Transparent Organic Plastics
  • D2520, Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650oC
  • D257, Standard Test Methods for DC Resistance or Conductance of Insulating Materials
  • D149, Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
  • E1356, Standard Test Method for Assignment of the Glass Transition Temperatures by Differential Scanning Calorimetry
  • D5470, Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials
  • D6343, Standard Test Methods for Thin Thermally Conductive Solid Materials for Electrical Insulation and Dielectric Applications

TAPPI Standards

This is a resource, not an exhaustive list, of possible relevant standards. Please visit https://www.tappi.org/Publications-Standards/Standards-Methods/ for a full list of standards 

  • T 543, Bending resistance of paper (Gurley-type tester) 
  • T 566, Bending resistance (stiffness) of paper (Taber-type tester in 0 to 10 Taber stiffness unit configuration)
  • T 494, Tensile properties of paper and paperboard (using constant rate of elongation apparatus)
  • T 489, Bending resistance (stiffness) of paper and paperboard (Taber-type tester in basic configuration)
  • T 538, Roughness of paper and paperboard (Sheffield method)

 

Please contact SEMI Standards if you would like to suggest standards to add to this website or if you would like to get involved in Flexible Electronics Standards at SEMI.
Email: FHEstandards@semi.org