MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13)
MILPITAS, Calif. ─ June 20, 2017 – MEMS & Sensors Industry Group® (MSIG), the industry association advancing MEMS and sensors across global markets, today announced its line-up of speakers for its TechXPOT program, What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business, on July 11 during SEMICON West 2017. Speakers from industry and academia will explore the disruptive influence of MEMS and sensors on applications that span human-machine interfaces, disposable wireless electronics, and wireless sensor nodes for smart cities. They will also discuss advancements in piezoelectric materials for emerging applications as well as MEMS foundry process technologies that speed time to market.
“From smart autos and smart manufacturing to smart cities and smart health monitoring, emerging markets for MEMS and sensors are creating greater demand for integrated intelligence,” said Karen Lightman, vice president, MEMS & Sensors Industry Group, SEMI. “MSIG speakers at SEMICON West will help MEMS and sensors suppliers to more ably respond to this demand, as they learn how to add value through technological innovation and integration.”
Topics and presenters at the MEMS program at the SEMICON West TechXPOT on July 11 include:
- What's Next for the MEMS Industry? ─ Jean-Christophe Eloy, CEO and founder, Yole Développement
- New MEMS Opportunities from Piezoelectric Technology ─ David Horsley, professor, Department of Mechanical & Aerospace Engineering, University of California Davis
- Smart IT Systems and Development Protocols Enable Faster Time-to-Market in MEMS ─ Tomas Bauer, senior VP, sales and business development, Silex Microsystems
- Waggle and the Future of Edge Computing and Smart Cities ─ Pete Beckman, co-director, Northwestern-Argonne Institute for Science and Engineering
- Roll-up Implementation of Gesture Sensing and Voice Isolation Sensing Wall for Future Human-Machine Interface ─ James Sturm, Ph.D., professor, electrical engineering, Princeton University
- Three Bit NFC Sensor Labels Based on a Flexible, Hybrid Printed CMOS TFT Process ─ Arvind Kamath, Ph.D., VP of engineering, Thin Film Electronics
Standards and Task Force Meetings at SEMICON West
MSIG also invites members to attend the Micro/Nano Electromechanical Systems (MEMS/NEMS) Committee Meeting, including a MEMS/NEMS Task Force on microfluidics, from 3:30-5:30 pm on July 13 at the San Francisco Marriott Marquis. For more information, visit: www.semiconwest.org/standards
About MEMS & Sensors Industry Group
MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, advances MEMS and sensors across global markets. MSIG advocates for near-term commercialization of MEMS/sensors-based products through a wide range of activities, including conferences, technical working groups, and industry advocacy. As a SEMI Strategic Association Partner, MSIG now reaches a global membership of more than 1,900 companies and industry partners. For more information, visit: www.semi.org/en/msig-information-hub and follow MSIG on LinkedIn and Twitter (use @MEMSGroup).
MEMS & Sensors Industry Group and the MEMS & Sensors Industry Group logo are trademarks of SEMI. All other product and company names are trademarks or registered trademarks of their respective holders.
Heidi Hoffman, MEMS & Sensors Industry Group
Maria Vetrano, Vetrano Communications