
KGD Packaging & Test Workshop 2010: “KGD and The Road to Finer Geometries”
October 28-29, 2010
The International KGD (Known Good Die) Packaging & Test Workshop is the leading source for information on semiconductor die products test, assembly, manufacturing, and business issues at
The workshop brings together technical experts, managers and business development professionals from around the world for an interactive exchange
This year’s workshop will have a special focus on the challenging issues for KGD as the industry moves to finer geometries
SEMI Members $420
All international registrations please use faxable Registration form (PDF)
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Keynote |
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“Known Good Die in the Era of Deep Submicron and 3D Integration” |
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Dr. Bill Bottoms, Chairman and CEO, Third Millennium Test Solutions, ITRS Roadmap Committee Chairman |
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See the full KGD workshop agenda. Who Should Attend
- Packaging management and Engineers
Location
The 2010 KGD workshop will be held at the West Pickle Research Building (formerly known as MCC). For Map and directions, please click here.
Thank you to our Sponsors
For more information about sponsorship opportunities, please click hereor contact Marlene Sibley at 408.943.6988 or msibley@semi.org |
Questions
For questions, please contact: Agnes Cobar at 1. 408.943.7952 or acobar@semi.org
Presented by:
The International KGD Packaging and Test Workshop is hosted by SEMI in partnership with
TechSearch International