October 28-29, 2010
West Pickle Research Building
3925 West Braker Lane
Austin, Texas

The International KGD (Known Good Die) Packaging & Test Workshop is the leading source for information on semiconductor die products test, assembly, manufacturing, and business issues at
the forefront of the microelectronics industry.

The workshop brings together technical experts, managers and business development professionals from around the world for an interactive exchange
of information on the latest developments in the die product industry. Over the years, workshop participants have helped to shape the evolution of KGD packaging from an early focus on specialized high performance systems to the successful low-cost solutions enabling the portable world.

This year’s workshop will have a special focus on the challenging issues for KGD as the industry moves to finer geometries

Registration

SEMI Members $420
Non Members $520
Speakers………… $200

All international registrations please use faxable Registration form (PDF)

Keynote

“Known Good Die in the Era of Deep Submicron and 3D Integration”

Dr. Bill Bottoms, Chairman and CEO, Third Millennium Test Solutions, ITRS Roadmap Committee Chairman

Agenda

See the full KGD workshop agenda.

- Packaging management and Engineers
- Test management and Engineers

Location

The 2010 KGD workshop will be held at the West Pickle Research Building (formerly known as MCC). For Map and directions, please click here.

The following hotels are within a few miles from the West Pickle Building.

For more information about sponsorship opportunities, please click hereor contact Marlene Sibley at 408.943.6988 or msibley@semi.org