KGD Packaging & Test Workshop 2010: “KGD and The Road to Finer Geometries”
October 28-29, 2010
Austin, Texas

The International KGD (Known Good Die) Packaging & Test Workshop is the leading source for information on semiconductor die products test, assembly, manufacturing, and business issues at
the forefront of the microelectronics industry.
The workshop brings together technical experts, managers and business development professionals from around the world for an interactive exchange
of information on the latest developments in the die product industry. Over the years, workshop participants have helped to shape the evolution of KGD packaging from an early focus on specialized high performance systems to the successful low-cost solutions enabling the portable world.
This year’s workshop will have a special focus on the challenging issues for KGD as the industry moves to finer geometries
- Packaging management and Engineers
- Test management and Engineers
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Location
The 2010 KGD workshop will be held at the West Pickle Research Building (formerly known as MCC)
West Pickle Research Building
3925 West Braker Lane
Austin, TX 78759
For Map and directions, please click here.
Call for papers is now closed.
Hotel Information
The following hotels are within a few miles from the West Pickle Building.
Sponsorship Opportunities
For more information about sponsorship opportunities, please contact Marlene Sibley at 408.943.6988 or msibley@semi.org.
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