KGD Packaging & Test Workshop 2010: “KGD and The Road to Finer Geometries” October 28-29, 2010 Austin, Texas The International KGD (Known Good Die) Packaging & Test Workshop is the leading source for information on semiconductor die products test, assembly, manufacturing, and business issues at the forefront of the microelectronics industry. The workshop brings together technical experts, managers and business development professionals from around the world for an interactive exchange of information on the latest developments in the die product industry. Over the years, workshop participants have helped to shape the evolution of KGD packaging from an early focus on specialized high performance systems to the successful low-cost solutions enabling the portable world. This year’s workshop will have a special focus on the challenging issues for KGD as the industry moves to finer geometries Who Should Attend Packaging management and Engineers Test management and Engineers

Location The 2010 KGD workshop will be held at the West Pickle Research Building (formerly known as MCC) West Pickle Research Building 3925 West Braker Lane Austin, TX 78759 For Map and directions, please click here. 2010 Call for Papers Call for papers is now closed. Hotel Information The following hotels are within a few miles from the West Pickle Building. Sponsorship Opportunities For more information about sponsorship opportunities, please contact Marlene Sibley at 408.943.6988 or msibley@semi.org.

Please click here to view workshop agenda

Registration

	Price until Sept 17	Starting Sept 18
SEMI Members	$395	$420
Non-Members	$495	$520
Speakers	$200	$200

For questions, please contact: Agnes Cobar at 1. 408.943.7952 or acobar@semi.org

The International KGD Packaging and Test Workshop is hosted by SEMI in partnership with
TechSearch International