Saturday, 26 February 2011 (optional side event)

18:00-22:00

Dinner at the restaurant Les Skieurs

Sunday, 27 February 2011 (optional side event)

09:00-16:00

Skiing day in Chamrousse – see details of side events

Sunday, 27 February 2011

18:00-21:00

Welcome Reception at the World Trade Center in Grenoble
Sponsored by Soitec

Monday, 28 February 2011 (Location: Grenoble)

10:00-16:00

Spouse Program (Guided Tourist & Shopping Tour)

Monday, 28 February 2011 (Location: World Trade Center, Grenoble)

08:30

Welcome Coffee sponsored by Edwards

09:00

Welcome
Cor Claeys, Chairman, ISS Europe Committee
Heinz Kundert, President, SEMI Europe
André-Jacques Auberton-Hervé, Chairman, SEMI Europe Advisory Board

09:15

Recorded Video – Welcome by Neelie Kroes, Vice President of the European Commission

09:20

"KET initiative: an opportunity for the European Semiconductor Industry"
Jean Therme, Director CEA Grenoble, Chairman of the European Commission KET HLG (Key Enabling Technologies, High Level Group)

KEYNOTES

Session Co-chairs:

09:50

“Strengths of semiconductors in Europe”
Carlo Bozotti, President and CEO, STMicroelectronics

10:25

“Outlook of electronics for e-mobility
Frédéric Barrand, Vice President Electrical and Electronic Systems Division, PSA Peugeot Citroën

11:00

Coffee Break sponsored by DAS

11:50

“Medical Healthcare and how Europe is well positioned for this market”
Diego Olego, Senior Vice President, Chief Technology Officer, Philips Healthcare

12:25

“Future Telecommunication Applications”
Douglas Gilstrap, Senior Vice President and Head of Group Function Strategy, Ericsson

13:00

Lunch

SESSION BUSINESS

Session Co-chairs:

14:00

“Reasons for optimism”
Bill McClean, President, IC Insights

14:30

“Boom Turned To Dust?”
Malcolm Penn, President and CEO, Future Horizons

15:00

“20 years of Intel Manufacturing in Europe, the successful story continues….”
Leonard Hobbs, Head of Research, Intel Ireland

15:30

Guest Speaker:

Richard Koo
Chief Economist, Nomura Research Institute

16:00

Coffee Break sponsored by Pays D’Aix Développement

16:30-17:30

Panel Discussion on “Semiconductor Manufacturing in Europe”

• Michael Lehnert, CEO, LFoundry
• Rutger Wijburg, Senior Vice President Front End Operations, NXP
• Hans-Juergen Straub, CEO, X-Fab
• Jens Drews, Director Government Relations, GLOBALFOUNDRIES
• Jean-Marc Chery, EVP, CTO, STMicroelectronics

19:00

Gala Dinner at the Musée de Grenoble
Buses depart from 18:00-18:30
Sponsored by STMicroelectronics

Tuesday, 1 March 2011 (Location: MINATEC, Grenoble)

SESSION TECHNOLOGY & SYSTEMS

Session Co-chairs:

08:30

Coffee Break sponsored by CEA-LETI

09:00

“Technical Trends”
Paolo Gargini, Intel fellow and group director, Technology & Manufacturing, Intel

09:30

“MEMS Technology: from Automotive to Consumer Applications”
Frank Melzer, CEO, Bosch Sensortec

10:00

Guest Speaker: “Internet of Things”

Prof. Dr. Elgar Fleisch
University of St. Gallen & ETH Zurich

10:30

Welcome Coffee sponsored by Edwards

11:00

“Success story of the advanced packaging technology eWLB (embedded wafer level ball grid array)”
Robert Hagen, Senior Director and Head of Wafer Level Packaging Segment, Infineon

13:30

“Title to be announced”
Iain Black, VP WW Mfg Engineering, Technology & Innovation, Lumileds (invited)

12:00

“Heterogeneous 3D Integration”
Laurent Malier, CEO, CEA-LETI

12:30

Lunch at “Maison MINATEC” sponsored by CEA/LETI

14:00-17:00

Company visits (optional, participation restricted and limited)

• Grenoble : CEA, LETI, MINATEC, MINALOGIC
• Crolles/Bernin : STMicroelectronics, SOITEC, Tronics

SIDE EVENTS

• Saturday & Sunday, 26-27 February 2011: Social get-together and activities
• Monday, 28 February 2011: Spouse tour
• Tuesday, 1 March 2011: Company visits
• View details of side-events