European 3D TSV Summit: “Application Ready” Theme to Focus on Both Business and Technology Aspects

SEMI to organize the 2nd European 3D TSV Summit

GRENOBLE, France — September 4, 2013 — The latest TSV product developments and achievements will be discussed at the 2nd edition of the SEMI European 3D TSV Summit on January 20-22, 2014 in Grenoble, France.  Building on the success of the 1st edition that attracted almost 320 people from 20 countries, the theme of this year’s event is “Application Ready,” addressing 3D TSV from both a business and technology perspective. The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global leading companies.

Executives from design houses, fabless, IDMs, OSATs as well as Equipment and Materials suppliers will present during this unique two-day event. More than 25 speakers will share their views during the plenary presentations as well as “round table” discussions.  An exhibition zone will be located at the heart of the venue, enabling companies to showcase their products and services to decision makers.  The 3D TSV Summit (www.semi.org/european3DTSVSummit) also includes a unique opportunity to visit the CEA-LETI 300mm TSV clean room. Prior the event, attendees will be able to prepare their Summit schedule on-site meetings by using a specially developed software tool.

New this year, as an introduction to the event, a Pre-Summit Symposium discussing MEMS and TSV will be held on January 20 in the late afternoon with an invited speaker, roundtable and welcome cocktail.

The event continues addresses the hot and controversial topics related to 3D TSV manufacturing and offers unique networking and promotion opportunities. The European 3D TSV Summit Steering Committee includes executives from: ams AG, BESI, CEA-LETI, EV Group, Fraunhofer-IZM, imec, Multitest, Oerlikon Systems, SPTS, STMicroelectronics, and SUSS Microtec.

Please visit www.semi.org/european3DTSVSummit.  Registration and booking for exhibition space is now open. Sponsorship packages are also available now.  For additional information, contact Yann Guillou from SEMI Europe Grenoble Office (yguillou@semi.org).

About SEMI

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contacts

Deborah Geiger/SEMI Headquarters
Email: dgeiger@semi.org
Phone: 1.408.943.7988

Yann Guillou/SEMI Europe Grenoble Office
Email: yguillou@semi.org
Phone: +33 (0)438783971

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