Guide to MEMS at SEMICON West 2012
Here’s our annual guide for navigating the MEMS events at SEMICON West, July 10-12, at Moscone Center in San Francisco:
TUESDAY, July 10, 10:30am-3:30pm
Taking MEMS to the Next Level: Transitioning to a Profitable High-Volume Business
Presented in cooperation with MIG
We’ve expanded the MEMS program to all day this year, and invited speakers from around the world to address practical potential solutions to the major manufacturing issues for growing the sector to the next level. Yole Développement’s J.C. Eloy and an invited speaker from a major IC maker give their views on the future of the industry and what it will take to get there. Doug Sparks from the new Chinese MEMS IDM Hanking Electronics talks about the opportunities in the China market. Hillcrest Labs CTO Charles Gritton presents software integration issues and motion sensing applications. Foundry executives Donald Robert from Teledyne Dalsa and Nancy Fares from Micralyne examine manufacturing solutions to speed time-to-market.
On the more technical side, Coventor’s Matt Kamon tells us what’s coming next in MEMS design automation software, Applied Materials’ Mike Rosa talks about next-generation DRIE, and Nikon’s Jumpei Fukui discusses the advantages of mini-steppers. In addition, Finnish startup ScanNano’s CEO Andrei Pavlov presents his work making low-cost cavities without etching and NIST’s Janet Cassard introduces standard reference materials and best practices for consistent characterization and troubleshooting of processes for calibrating instruments and communicating between customers and suppliers.
Location: Extreme Electronics TechXPOT at Moscone Center (South Hall). The stage is in the same place as last year, in the far back right-hand corner of the Moscone South exhibit hall.
WEDNESDAY, July 11, 5:00-7:00pm
MIG Happy Hour
MEMS Industry Group will host its annual Happy Hour at SEMICON West. Invitations will be sent soon. Contact MIG for details.
Location: to be announced
THURSDAY, July 12, 10:30am-12:30pm
MEMS and Sensor Packaging
The SEMI Packaging Committee presents a program focusing on MEMS packaging technology issues, with Florian Solzbacher from the University of Utah’s Utah Nanofabrication Laboratory and invited speakers from Analog Devices, and InvenSense and Kionix.
Location: TechXPOT North, Moscone Center (North Hall)
THURSDAY, July 12, 12:10-1:00pm
Flexible Batteries and Flexible Mounting of Thinned Silicon Die on Textiles, Skin Patches and Implants
MEMS folks interested in integrating sensors into innovative wearable, flexible, implantable applications may want to check out presentations in the Plastic Electronics program on patterning flexible batteries on unconventional substrates and embedding thinned conventional silicon die into flexible polymer packaging, from companies who don’t typically show up at MEMS events. Imprint Energy talks about its low-cost, high-energy density Zn polymer battery technology suitable for wireless and wearable sensors, while MC10 describes its conformal electronics packaging targeted at wearable and implantable sensors.
Location: Extreme Electronics TechXPOT, Moscone Center (South Hall)
For more information on SEMICON West 2012, please visit www.semiconwest.org. Register now through June 2 to save $100 on your “Expo Only” badge (cost is $50 through June 2; $150 onsite). If you would like to exhibit at SEMICON West, please click here or call 408.943.7870.