SEMI Co-Sponsors Conferences Addressing Known Good Die (KGD) and 3D Packaging Challenges

SAN JOSE, Calif. — August 9, 2011 — Industry experts will gather at the annual Known Good Die (KDG) conference to address the mounting challenges in semiconductor die product test, assembly, manufacturing and business. The conference— organized by MEPTEC and co-sponsored by SEMI— focuses on: “KGD in an Era of Multi-Die Packaging and 3D Integration.” The event will be held on November 10, 2011 at the Biltmore Hotel in Santa Clara, California, and is co-located with another MEPTEC conference, “2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream,” set for November 9.

“Mobile consumer products including tablets and smart phones are driving adoption of multi-function 3D, vertically stacked or multichip packages to meet demanding performance and form factor requirements,” states Jonathan Davis, president of the Semiconductor Business Unit at SEMI.  “The increasingly complex configurations and packages require high-quality known good die to ensure product functionality and cost performance.  We are pleased to support MEPTEC in presenting this important event as the industry addresses the challenges of 3D integration.”

For 18 years, the KDG conference has marshaled technical experts, managers and business development professionals from around the world for an interactive exchange on the latest developments in the die product industry.

The KGD conference sessions will cover such topics as KGD test, handling, delivery, standards, current methods, options and infrastructure.  For more information on the Known Good Die conference, visit: For more information on the 3D Integration conference, please visit:,3dbeyo.html. To register for the KGD and/or the 3D Packaging conference, visit:,3dkno.html.

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit


Since its inception 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling. Through our membership of subcontractors, semiconductor manufacturers and vendors to the back end, and an Advisory Board consisting of individuals from different segments of the back-end semiconductor industry, we continuously strive to improve and elevate the roles of assembly and test professionals in the industry. For more information, visit

Association Contacts

Bette Cooper/MEPTEC
Phone: 650.714.1570

Deborah Geiger/SEMI

Phone: 408.943.7988



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