Cranston, RI, USA – Technic is pleased to announce the full commercial release of Elevate Cu 6370, a versatile electrolytic copper plating process for semiconductor advanced packaging applications.
Over the past two years, Elevate Cu 6370 has been in limited release and used in wide variety of applications. With slight modifications to the electrolyte, Elevate Cu 6370 has been highly successful in tight RDL patterns, standard pillars, 200-micron tall mega pillars, bump on passivation structures, and other advanced packaging structures. The process is ideally suited for a variety of semiconductor advanced packaging platforms, including FOWLP (Fan-Out Wafer Level Packaging) Fan-In Wafer Level Packaging, and 2.5D/3D. Elevate Cu 6370 can be adjusted to plate at lower speeds of 1 – 2 microns per minute or very high speeds of 6 – 7 microns per minute. It can also be tuned to provide a domed, flat or dished deposit.
“As the copper ECD market for advanced packaging continues to grow, customers are looking for a single solution to meet a variety of feature specifications. Elevate Cu 6370 has demonstrated consistent and proven success, offering versatility, high performance, and low Cost of Ownership (CoO).” - Anthony Gallegos, Global Product Manager, Semiconductor Technology
Learn more at www.technic.com
Technic Inc. is a Rhode Island based corporation with over 950 employees worldwide. For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Release Contact: Bob Sheeran email@example.com 401-785-8763 Technic Elevate® 6370 Electrolytic Copper Plating Process