Industry News Archive Provided by SEMI

Industry News Archive

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

Blog Review: March 22
(Semiconductor Engineering - 22 Mar 2017)

Chipzilla Got Toppled
(Bloomberg - 21 Mar 2017)

Micron establishes its center of excellence for DRAM in Taiwan
(Display Plus - 21 Mar 2017)

N. American Semi Equipment Billings Up 64% in Feb.
(Printed Circuit Design & Fab Magazine - 21 Mar 2017)

5 reasons why China will rule tech, 2017 edition
(Computerworld - 21 Mar 2017)

SEMI headquarters relocates
(Solid State Technology - 20 Mar 2017)

Chinese M&A Scrutiny Helped Void Up to $75 Billion in Deals
(Bloomberg - 20 Mar 2017)

Further Thoughts from the 2017 SPIE AL EUV Lithography Conference
(Semiconductor Manufacturing & Design - 20 Mar 2017)

NASA Backs Startup Developing 'Smart' Color-Changing Air Filters
(PR Newswire - 20 Mar 2017)

IBM researchers prove it’s possible to store data on a single atom
(Electronic Products Magazine - 20 Mar 2017)

Star-spangled find may lead to advanced electronics
(Nanowerk - 20 Mar 2017)

Patterning Problems Pile Up
(Semiconductor Engineering - 20 Mar 2017)

TSMC Tips 7+, 12, 22nm Nodes
(Electronic Engineering Times - 16 Mar 2017)

SEMI Reports 2016 Global Semiconductor Equipment Sales of $41.2 Billion
(EMS Now - 16 Mar 2017)

ASML strikes deal with China equipment maker
(Digitimes - 16 Mar 2017)

SEMI Leads Smart Manufacturing Evolution
(EMS Now - 15 Mar 2017)

SEMI reports 2016 global semiconductor equipment sales of $41.2B
(Solid State Technology - Blog - 14 Mar 2017)

DoD Task Force Says No to Trusted Foundry
(Printed Circuit Design & Fab Magazine - 13 Mar 2017)

Intel races ahead in autonomous cars with $15.3 billion Mobileye buy
(PC World Australia - 13 Mar 2017)

Entegris Partners with China's Spectrum Materials to Manufacture Entegris Specialty Chemicals in China
(PR Newswire - 13 Mar 2017)

InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology
(Press Release Point - 9 Mar 2017)

Worst-Case Results Causing Problems
(Semiconductor Engineering - 9 Mar 2017)

Blog Review: March 8
(Semiconductor Engineering - 8 Mar 2017)

The Case For Narrowband-IoT
(Semiconductor Engineering - 8 Mar 2017)

Record spending for fab equipment expected in 2017 and 2018
(Solid State Technology - Blog - 7 Mar 2017)

Record Spending for Fab Equipment Expected in 2017 and 2018
(TMCnet.com - 7 Mar 2017)

Intel Announces the 2016 Supplier Continuous Quality Improvement Awards
(Press Release Point - 6 Mar 2017)

Sweat patch mops up real-time performance monitor
(Solid State Technology - Blog - 6 Mar 2017)

Semiconductor manufacturing’s next big thing at ASMC 2017
(Solid State Technology - 2 Mar 2017)

[2017FLEX Japan] Japan’s first flexible hybrid electronics conference will be held on April 11 - 12
(Display Plus - 1 Mar 2017)

SEMICON Southeast Asia 2017 World of IoT: Futura-X showcase
(Display Plus - 1 Mar 2017)

ASML Revs EUV Engines
(Electronic Engineering Times - 1 Mar 2017)

NextFlex Honors Several Dedicated Individuals Contributing to FHE Industry
(Printed Electronics Now - 1 Mar 2017)

What Does An AI Chip Look Like?
(Semiconductor Engineering - 1 Mar 2017)

SEMICON China Set for China's Booming Semiconductor Manufacturing
(EMS Now - 28 Feb 2017)

Lattice Shareholders Approve China Takeover
(Electronic Engineering Times - 28 Feb 2017)

IoT to shake up manufacturing sector
(Solid State Technology - Blog - 27 Feb 2017)

Expand Connections and Opportunities at LED Taiwan 2017
(EMS Now - 24 Feb 2017)

KLA-Tencor introduces new metrology systems
(Solid State Technology - 23 Feb 2017)

Foxconn may seek majority stake in Toshiba's memory ops
(Nikkei Asian Review - 23 Feb 2017)

Applied Materials rides high on China's chip, panel ambitions
(Nikkei Asian Review - 22 Feb 2017)

SEMI posts North American equipment industry billings (Evaluation Engineering - 22 Feb 2017)

Big Changes In Patterning (Semiconductor Engineering - 22 Feb 2017)

MEMS: A Tale Of Two Tough Markets (Semiconductor Engineering - 22 Feb 2017)

SEMI appoints Ajit Manocha as President and CEO (Solid State Technology - Blog - 21 Feb 2017)

SEMI Appoints Ajit Manocha as President and CEO (PR Newswire (EN) - 21 Feb 2017)

Manufacturing Bits: Feb. 21 (Semiconductor Engineering - 21 Feb 2017)

Intel Continues to Drive Semiconductor Industry R&D Spending (EMS Now - 20 Feb 2017)

Semiconductor Process Development: Finding A Faster Way To Profitability (Semiconductor Engineering - 20 Feb 2017)

Get Ready For Nanotube RAM (Semiconductor Engineering - 20 Feb 2017)

Applied Materials says that we're just at the beginning of the OLED adoption cycle (OLED Info - 19 Feb 2017)

Vital Control in Fab Materials Supply-Chains – Part 2 (Blogs - Semiconductor Manufacturing & Design Community - 16 Feb 2017)

Breakthrough in 'wonder' materials paves way for flexible tech (Phys.org - 16 Feb 2017)

China Moves To Top Spot In Fab Equipment Spending (Semiconductor Engineering - 16 Feb 2017)

Progress In Flexible Electronics (Semiconductor Engineering - 16 Feb 2017)

Battling Fab Cycle Times (Semiconductor Engineering - 15 Feb 2017)

3D and 2.5D IC packaging market expected to be worth $170B by 2022 (Solid State Technology - Blog - 14 Feb 2017)

NextFlex Announces Next Set of Projects (Printed Electronics Now - 14 Feb 2017)

Winners & Losers of GloFo's China Deal (EE Times Blogs - 13 Feb 2017)

GlobalFoundries 12-inch wafer production line in Chengdu commences operation (Solid State Technology - Blog - 13 Feb 2017)

TSMC Says Impact from Quake Not Material (Electronic Engineering Times - 13 Feb 2017)

How China's Dealmakers Pulled Off a $207 Billion Global Spree
(Bloomberg - 13 Feb 2017)

Intel $7 Billion Investment in Next-Gen Semiconductor Factory »
(Silicon Semiconductor - 13 Feb 2017)

GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand: Company invests for capacity growth in the United States, Germany, China and Singapore
(Nanotechnology Now - 10 Feb 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 10 Feb 2017)

Intel announces $7B investment in next-gen semiconductor fab in Arizona
(Solid State Technology - 9 Feb 2017)

Fix Processes, Then Silos
(Semiconductor Engineering - 9 Feb 2017)

Toshiba starts construction of Fab 6 and Memory R&D Centre
(New Electronics - 9 Feb 2017)

SEMICON Korea huge 30th year anniversary event opens today
(Solid State Technology - 8 Feb 2017)

An oxide semiconductor just single atom thick
(Nanowerk - 8 Feb 2017)

Addressing Test Time Challenges
(Semiconductor Engineering - 8 Feb 2017)

Annual silicon volume shipments remain at record highs
(Solid State Technology - Blog - 7 Feb 2017)

Advantest Will Showcase Products, Demonstrations and a Technical Paper at SEMICON Korea, February 8-10 in Seoul
(Digitimes - 7 Feb 2017)

How Germany Hammers Down Renewable Energy Costs: QuickTake Q&A
(Bloomberg - 7 Feb 2017)

SK Hynix Makes Bid to Buy Part of Toshiba’s Memory Chip Arm
(Bloomberg - 7 Feb 2017)

Betting On Wafer-Level Fan-Outs
(Semiconductor Engineering - 6 Feb 2017)

Chip-Package-Board Issues Grow
(Semiconductor Engineering - 6 Feb 2017)

Uncovering Unintended Behavior
(Semiconductor Engineering - 3 Feb 2017)

Friday Quiz: Acquired Companies, Part 3
(EE Times Blogs - 2 Feb 2017)

Global semiconductor sales reach $339 billion in 2016
(Display Plus - 2 Feb 2017)

Work Remains To Enable Connected Cars, Automotive Security
(Semiconductor Engineering - 2 Feb 2017)

Q'comm-NXP Faces Trump, China Hurdles
(Electronic Engineering Times - 2 Feb 2017)

“Escape Room” Game Challenges Physics-Phobes to Face Their Fear
(Scientific American - 2 Feb 2017)

Samsung could set up a plant in US to manufacture home appliances – report
(International Business Times UK - 2 Feb 2017)

Thin, flexible, light-absorbent material for energy and stealth applications
(Nanowerk - 2 Feb 2017)

Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016
(EMS Now - 1 Feb 2017)

Without technology, China's "MIC 225" results for ICs likely to fall woefully short of its goals
(Display Plus - 1 Feb 2017)

Rethinking Stats In Manufacturing Equipment
(Semiconductor Engineering - 1 Feb 2017)

FlexTech announces contract for battery development with ITN Energy Systems
(Solid State Technology - Blog - 31 Jan 2017)

Our Man in China: Ask Yorbe
(EE Times Blogs - 30 Jan 2017)

[SEMICON Korea 2017] Air Products expand nitrogen capacity in Korea’s Pyeongtaek City to support increasing demand of semiconductor industr
(Display Plus - 30 Jan 2017)

New 'made in China' chip on the way as country boosts indigenous tech
(ComputerWorld Malaysia - 30 Jan 2017)

Managing Parasitics For Transistor Performance
(Semiconductor Engineering - 30 Jan 2017)

STMicroelectronics Showcases its Latest Solutions for Smart Driving »
(Silicon Semiconductor - 30 Jan 2017)

Car electrification calls for more standardization, says Silicon Mobility
(EETE Automotive - 27 Jan 2017)

Trump, Brexit Cloud Upbeat 2017
(Electronic Engineering Times - 26 Jan 2017)

Bidding War On H-1B Visas?
(Semiconductor Engineering - 26 Jan 2017)

Foxconn's U.S. Plan Doesn't Add Up
(Bloomberg - 23 Jan 2017)

STATS ChipPAC recognized for patent innovations for the seventh consecutive year by IEEE
(Solid State Technology - Blog - 23 Jan 2017)

Deals Dominate Semiconductors
(Mannerisms - Electronics Weekly Blog - 23 Jan 2017)

X-Fab is Fastest Growing Foundry
(Electronic Engineering Times - 23 Jan 2017)

China responds to US chip threats with a USD 30 bn factory
(Computer World Singapore - 23 Jan 2017)

Why Every Company Is A Technology Company
(Forbes - 23 Jan 2017)

Semiconductor M&A reach peak in 2015-2016, says IC Insights
(Digitimes - 20 Jan 2017)

Tsinghua to Build $30 Billion Memory Fab in China
(Electronic Engineering Times - 19 Jan 2017)

What’s Up MEMS?
(Semiconductor Engineering - 19 Jan 2017)

China Factors Heavily In Policy And Business Considerations
(Semiconductor Engineering - 19 Jan 2017)

5 Takeaways From ISS
(Semiconductor Engineering - 19 Jan 2017)

China Unveils Memory Plans
(Semiconductor Engineering - 19 Jan 2017)

Chip Sales Grew 1.5% in ‘16, Gartner says
(Electronic Engineering Times - 18 Jan 2017)

Future of Chip Research Group Questioned
(Electronic Engineering Times - 18 Jan 2017)

Blog Review: Jan. 18
(Semiconductor Engineering - 18 Jan 2017)

Extending the era of Moore’s Law through lower cost patterning »
(Silicon Semiconductor - 17 Jan 2017)

CEOs Rush to Avoid Trump’s Wrath With Stops at the Gilded Tower
(Bloomberg - 17 Jan 2017)

What Can Go Wrong In Automotive
(Semiconductor Engineering - 17 Jan 2017)

Manufacturing Bits: Jan. 17
(Semiconductor Engineering - 17 Jan 2017)

Commentary: A lesson to be learned from China panel industry headhunting
(Digitimes - 16 Jan 2017)

Outlook for 450 mm wafers fades »
(Silicon Semiconductor - 13 Jan 2017)

Fab investment surging in China, says SEMI
(Digitimes - 13 Jan 2017)

TSMC could build plant in the US, says Chang
(Digitimes - 12 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Display Plus - 12 Jan 2017)

EDA in the year 2017 – Part 1
(Chip Design Blogs - 12 Jan 2017)

China Defends Big Chip Bet
(Electronic Engineering Times - 12 Jan 2017)

TSMC Expects Flat Year for Foundry
(Electronic Engineering Times - 11 Jan 2017)

China Expected to Poach More Taiwan Chip Execs
(Electronic Engineering Times - 11 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Solid State Technology - Blog - 10 Jan 2017)

Semiconductor eyed for next-generation 'power electronics'
(Phys.org - 10 Jan 2017)

Manufacturing Bits: Jan. 10
(Semiconductor Engineering - 10 Jan 2017)

Blog Review: Jan. 4
(Semiconductor Engineering - 4 Jan 2017)

BRIEF-TSMC orders machinery equipment from Lam Research, Applied Materials
(Business News & Financial News - Reuters - 3 Jan 2017)

Printed Electronics Now’s Top 10 Online Exclusives for 2016
(Printed Electronics Now - 3 Jan 2017)

Chip Sales Grew Sharply in November
(Electronic Engineering Times - 3 Jan 2017)

Bloomberg’s Srinivasan: Move From China Could Harm Chip Makers
(Bloomberg - 3 Jan 2017)

TSMC 7nm ready for customer tape-outs in 2Q17, says report
(Digitimes - 3 Jan 2017)

Yangtze River Storage breaks ground for memory plant
(Digitimes - 2 Jan 2017)

Obama to Urge Protection for Chip Industry
(Electronic Engineering Times - 2 Jan 2017)

Intel Finds Moore’s Law’s Next Step at 10 Nanometers
(IEEE Spectrum - 30 Dec 2016)

LED Technology Breakthroughs in 2016
(LEDInside - 29 Dec 2016)

More Reactive, Less Warming
(Semiconductor Engineering - 29 Dec 2016)

China's Belt and Road initiative vital to Asian job creation
(Nikkei Asian Review - 28 Dec 2016)

IoT Ready to Light Up in 2017
(Electronic Engineering Times - 27 Dec 2016)

Toshio Maruyama of Advantest receives SEMI Marketing Excellence Award
(Digitimes - 27 Dec 2016)

Ten Best Chip CEOs 2016
(Mannerisms - Electronics Weekly Blog - 27 Dec 2016)

TSMC Says 10nm on Track, Countering Reports
(Electronic Engineering Times - 27 Dec 2016)

BRIEF-TSMC orders equipment from Wholetech System, Applied Materials, Tokyo Electron
(Business News & Financial News - Reuters - 26 Dec 2016)

Your Year in Review, Unsung Hero
(EE Times Blogs - 26 Dec 2016)

Samsung to Form QD TV Alliance
(LEDInside - 26 Dec 2016)

Japan Inc. Shows Its Savvy
(Bloomberg - 26 Dec 2016)

A year in review: Top 10 stories of 2016
(Solid State Technology - Blog - 23 Dec 2016)

Japan Is Developing a 'Hydrogen Society' in Mt. Fuji's Shadow
(Bloomberg - 22 Dec 2016)

Moore’s law and the impact on the raw material supply chain
(EMS Now - 22 Dec 2016)

Reflecting Back On 2016: Tools, Designs, Manufacturing
(Semiconductor Engineering - 22 Dec 2016)

Honey, I shrunk the circuit
(ScienceDaily - 21 Dec 2016)

Flexible and Printed Electronics in 2016: The Year in Review
(Printed Electronics Now - 21 Dec 2016)

Foundries See Mixed Future
(Semiconductor Engineering - 21 Dec 2016)

Blog Review: Dec. 21
(Semiconductor Engineering - 21 Dec 2016)

Wafer Works to set up 8-inch fab in China
(Digitimes - 20 Dec 2016)

Chips Execs See Maturing Industry
(Electronic Engineering Times - 20 Dec 2016)

62 new facilities start operation 2017 and beyond
(Solid State Technology - Blog - 19 Dec 2016)

Toshio Maruyama to Receive SEMI Marketing Excellence Award at SEMICON Japan
(EMS Now - 19 Dec 2016)

China’s Memory Drama: Must-See in 2017
(Electronic Engineering Times - 19 Dec 2016)

Uncertainty Grows For 5nm, 3nm
(Semiconductor Engineering - 19 Dec 2016)

China Dominates Planned Chip Fabs
(Electronic Engineering Times - 15 Dec 2016)

Fab Tool Biz Faces Challenges In 2017
(Semiconductor Engineering - 15 Dec 2016)

Inside Advanced Patterning
(Semiconductor Engineering - 15 Dec 2016)

New fab facilities: China dominates, followed by Americas and Taiwan
(Solid State Technology - 14 Dec 2016)

SEMICON China 2017 presents six forums in China’s explosive growth market
(Solid State Technology - 14 Dec 2016)

New Fab Facilities: China Dominates, Followed by Americas and Taiwan
(EMS Now - 14 Dec 2016)

Globalfoundries demoes finfet silicon running at 56Gbit
(Electronics Weekly - 13 Dec 2016)

Semiconductor Equipment Sales Forecast - $40 Billion
(EMS Now - 13 Dec 2016)

Manufacturing Bits: Dec. 13
(Semiconductor Engineering - 13 Dec 2016)

Chip manufacturing equipment market grows 8.7%
(Electronics Weekly - 13 Dec 2016)

TSMC plans 3/5nm fab for 2022
(Electronics Weekly - 12 Dec 2016)

Commentary: Silicon wafer industry headed for consolidation
(Digitimes - 12 Dec 2016)

Engineers integrate internal robotic tactile sensors
(Phys.org - 12 Dec 2016)

China Eyes Chip Market Amid Growing Demand
(Forbes.com - 9 Dec 2016)

Chinese firm scraps German tech deal after US block
(Phys.org - 8 Dec 2016)

A stamp to print electronic inks
(New Electronics - 8 Dec 2016)

What Comes After Moore’s Law And Dennard Scaling?
(Semiconductor Engineering - 8 Dec 2016)

Reflecting Back on 2016: Markets
(Semiconductor Engineering - 8 Dec 2016)

Five suppliers to hold 41% of global semiconductor marketshare in 2016
(Solid State Technology - 7 Dec 2016)

Qualcomm Launches The First 10nm Server Chip
(Forbes.com - 7 Dec 2016)

ClassOne reports record sales, driven by wafer-level packaging and More than Moore technologies
(Semiconductor Today - 7 Dec 2016)

Blog Review: Dec. 7
(Semiconductor Engineering - 7 Dec 2016)

TSMC to build new plant for 5nm and newer processes
(Digitimes - 6 Dec 2016)

Brewer Science unveils temporary wafer bonding technology for advanced packaging
(Display Plus - 6 Dec 2016)

Why China Wants U.S. Memory Chip Technology -- And What Washington Is Doing About It
(Forbes.com - 6 Dec 2016)

Semiconductor Materials: Restructuring in the Supplier Base
(Semiconductor Manufacturing & Design - 6 Dec 2016)

TSMC, IBM Detail 7-nm Work
(Electronic Engineering Times - 6 Dec 2016)

Fabless Industry Shrinks
(Electronics Weekly - 6 Dec 2016)

Global 3Q16 semiconductor equipment billings rise, says SEMI
(Digitimes - 6 Dec 2016)

Manufacturing Bits: Dec. 6
(Semiconductor Engineering - 6 Dec 2016)

China holds mantle of Asia's technology, science power
(Nikkei Asian Review - 6 Dec 2016)

Lawmakers Urge Rejection of Lattice Semi Takeover
(Electronic Engineering Times - 5 Dec 2016)

Taiwan leads semiconductor equipment purchases
(Electronics Weekly - 5 Dec 2016)

China to US: Avoid politics in purchase of Germany's Aixtron
(Phys.org - 2 Dec 2016)

TSMC lands new 28nm chip orders for UFS controllers
(Digitimes - 2 Dec 2016)

Obama Said Poised to Block Chinese Takeover of Germany’s Aixtron
(Bloomberg - 1 Dec 2016)

Third Time Could Be The Charm For Silicon Valley And Japan
(Forbes.com - 1 Dec 2016)

RISC-V Expands its Audience
(Electronic Engineering Times - 1 Dec 2016)

IoT, Architectures, And Security
(Semiconductor Engineering - 1 Dec 2016)

2016 News Archive

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2013 News Archive

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2011 News Archive