Richard Ellinger - Physically Flexible Smart Asset Monitor and Tracking Tag

Session 11: FHE Applications I

Physically Flexible Smart Asset Monitor and Tracking Tag
Wednesday, June 21, 2017 
11:30 AM - 11:50 AM

Environmental exposure monitoring, especially temperature, is crucial for assessing and maintaining viability of high-value items including pharmaceuticals, life science materials, industrial supplies and food during shipment and storage. American Semiconductor is working under a NextFlex program to deliver low profile, physically flexible Smart-Tags capable of automatically logging environmental data and wirelessly transmitting the data using an industry-standard RFID protocol. This low-cost flexible hybrid electronics system will include a flexible antenna, battery, complex integrated circuit and wireless communications. The Smart-Tag will be supported by a full product infrastructure of readers, documentation, test data, volume manufacturing flows and a clear commercialization path. The Smart-Tag is also planned as a platform to enable future integration of more complex flexible integrated circuits and additional sensors to create high-value asset monitoring. PakSense (an Emerson Company and industry leader in intelligent sensing products specifically designed to monitor perishable goods) will perform field-testing and participate in defining commercial goals. In addition, Boise State University will provide workforce development, education and training for FHE design and manufacturing.


Speaker's Biography



Richard Ellinger
American Semiconductor, Inc.