Douglas Hackler - Complex Flexible Hybrid Electronic Labels

Session 9: Flexible Electronics Applications I

Complex Flexible Hybrid Electronic Labels
Wednesday, February 14, 2018
1:30 PM - 1:55 PM

The industry has sought hybrid systems that can provide capability for monitoring and tracking environmental conditions of temperature sensitive materials like those for pharmaceuticals in the Bio-Medical industry and other perishable products. American Semiconductor, with support from NextFlex has developed a hybrid smart-label that demonstrates advanced hybrid manufacturing feasibility and working prototypes for next generation smart-labels. Results from hybrid integration of a fully flexible ultra-thin SoP IC (TRL 6), a flexible battery (TRL7) and a printed circuit and antenna inlay (TRL9) are provided. This talk shares advances in flexible ICs and hybrid assembly that includes: mounting ICs on printed substrates, device interconnection with printed materials, flexible battery integration, antenna integration, and demonstrations of a complex flexible hybrid electronic (FHE) system. • Smart Tracking Tag hybrid RFID system developed by American Semiconductor with support of NextFlex • Flexible hybrid system tracker demonstration including temperature sensor, flexible SoP IC, flexible battery, printed antenna and complete EPC Gen 2 wireless communications. • Advanced manufacturing approaches for flexible hybrid electronic assembly This presentation will show the state-of-the-art results in flexible hybrid system integration demonstrated with the Smart Tracking Tag hybrid system developed by American Semiconductor with support from NextFlex.

 

Speaker's Biography

Mr. Hackler is President & CEO of American Semiconductor, having co-founded the company in 2001, and is a co-inventor of Semiconductor-on-Polymer technology. At American Semiconductor Doug maintains overall corporate and operational responsibilities. He is a flexible electronics industry advocate and leader who is known for his commitment to industry development of new flexible products. He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at American Semiconductor, M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has served as the Principal Investigator (PI) on multiple projects, generated multiple patents and patents pending for conventional and flexible solid state technology and has published numerous technical papers. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).

 



SPEAKER
Douglas Hackler
President & CEO
American Semiconductor