Session 6: Standards & Reliability
Advances in Flexible Hybrid Electronics Reliability
Wednesday, June 21, 2017
8:45 AM - 9:05 AM
Flexible Hybrid Electronics (FHE) reliability testing is a new field. American Semiconductor has been working with AFRL to address practical reliability standards and test methodologies for FHE systems.
Rather than try to develop new test methodologies and standards from scratch, we have drawn from other, related industries where applicable. We have completed extensive research of the smart card industry, semiconductor industry, and U.S. military to identify a variety of relevant test standards and procedures that can be used as guidance for forming FHE test methods. This list includes, but is not limited to:
• JESD22-A110E (HAST)
• JESD220A102E (Accelerated Moisture Resistance)
• JESD22-A108D (Temperature Bias and Operating Life)
• ISO/IEC 7810 (Identification cards – Physical characteristics)
• ISO/IEC 7816-1 (Identification cards – integrated circuit cards)
• ISO/IEC 10373-1 (Identification cards – Test methods)
• IPC-TM-650 (Flexural fatigue life for a given bend radius)
• ASTM D522/D522M (Mandrel Bend Test of Attached Organic Coatings)
• MIL-STE-883K 1010.9 (Temperature Cycling) • MIL-STD-883K 2018.6 (SEM Inspections)
This project included a review of over 30 relevant standards, procedures, and specifications for FleX FHE reliability assessment. A prioritization and down selection from this review resulted in identification of seven relevant test procedures for this initial reliability investigation.
This presentation will provide an overview of FHE reliability testing and methods. More importantly we will present results of FHE reliability tests to provide systems designers a baseline of current FHE capability.
As a seasoned semiconductor leader for over 30 years, Doug has a proven industry track record of assembling and managing engineering, operations, marketing and management teams. He is President & CEO of American Semiconductor, having co-founded the company in 2001, and is a co-inventor of Semiconductor-on-Polymer technology. At American Semiconductor Doug maintains overall corporate and operational responsibilities. He is a flexible electronics industry advocate and leader who is known for his commitment to industry development of new flexible products. He has more than 30 years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has served as the Principal Investigator (PI) on multiple projects, generated multiple patents and patents pending for conventional and flexible solid state technology and has published numerous technical papers. Mr. Hackler holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).
American Semiconductor Inc.