Denis Cormier - Printed Electronics Using Magnetohydrodynamic Droplet

Session 10: Direct Write & 3D Printing II

Printed Electronics Using Magnetohydrodynamic Droplet Jetting of Molten Aluminum and Copper
Wednesday, February 14, 2018
2:15 PM - 2:35 PM

Magnetohydrodynamic (MHD) droplet jetting is a new digital printing technology capable of producing solid copper or aluminum conductive electronic traces and 3D objects. The process uses extremely inexpensive metal wire as the incoming feedstock material rather than inks. Each jetted molten metal droplet partially overlaps with previously deposited material and solidifies to produce fully dense conductive metal traces whose electrical conductivities approach those of the bulk material. The process is therefore particularly well suited for high current applications. This talk will first present an overview of how the MHD process works. Next, practical considerations with respect to electrical conductivity, density, substrate compatibility, adhesion, flexural performance, and other metrics will be discussed. Lastly, the talk will look forward to applications involving fabrication of highly conductive printed electronics on non-planar surfaces.

 

Speaker's Biography

Denis Cormier, RIT’s Earl W. Brinkman Professor and an international expert on 3D printing and additive manufacturing, is the director of the AMPrint Center. Dr. Cormier has secured more than $15M in sponsored research funding over his career to date. He has been highly active in the additive manufacturing community for nearly 20 years. Dr. Cormier was a pioneer in the development of structured metal lattices. Prior to joining RIT, he founded NC State University’s highly regarded Rapid Prototyping Lab in 1996. In 2003, he and Ola Harrysson purchased the first Arcam Electron Beam Melting (EBM) machine ever installed in North America. From 2003-2009, Cormier’s metal additive manufacturing research focused on aerospace applications and materials. Much of his funded aerospace research involved developing EBM process parameters for aerospace materials of interest including titanium alloys (Ti-6Al-4V,TiAl3), aluminum alloys (6061 Al, 7075 Al), copper alloys (CP copper, GR-Cop84), Inconel, and other alloys.

 



SPEAKER
Denis Cormier
Earl W. Brinkman Professor, AMPrint Center Director
Rochester Institute of Technology