Session 12: FE Tools & Methods
Temporary bonding layers for plastic-based microfabrication of flexible displays
Wednesday, February 14, 2018
5:00 PM - 5:20 PM
Plastic-based electronics processing in the display industry has taken advantage of many technologies, the most well-known of which is Phillips’ electronics on plastic by laser release (EPLaR). While this technique takes advantage of much equipment in a traditional glass-based display line, the laser release of plastic substrates is a high-cost, low-throughput and defect prone process. In response, Ares has developed a novel temporary bonding material (ATB) which removes the need for laser debonding after microfabrication. Instead, substrate release can be achieved via solely mechanical debonding at release forces below 5 cN/cm. Herein, we demonstrate ATB release layers used for the temporary bonding of both the Pylux family of polysulfide thermosets, as well as pyromellitic dianhydride-co-4,4′-oxydianiline based (PMDA-ODA) solution-cast polyimide films.
Dr. David Arreaga is the CEO and co-founder of Ares Materials Inc., company focused on the development of novel polymer films for flexible electronics. David did his graduate research at the University of Texas at Dallas where he obtained his M.S. and Ph.D. working in the fields of thin film lithium ion batteries and flexible neural interfaces. As the CEO of Ares, David’s job is to lead the development of the company by leveraging a talented team of scientist and business experts for the commercialization of novel materials technologies in the fields of flexible electronics for consumer and industrial applications.